# US 5,703,493 A · Wafer holder for semiconductor applications

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- Number: US 5,703,493 A
- Document ID: US5703493A
- Status: Granted
- Kind: A
- Application number: 08/548,109
- Filed: 1995-10-25
- Granted: 1997-12-30
- Earliest claimed: 1995-10-25
- Assignees: Motorola, Inc.
- Inventors: Anthony R. Weeks; Mark D. Norris; Steven A. Switzer
- Web page: https://patentgrep.com/patent/US5703493A

## CPC

- H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks
- G01R 1/04: Housings; Supporting members; Arrangements of terminals
- G03F 7/70691: {Handling of masks or workpieces}
- H10P 72/7606: {characterised by edge clamping, e.g. clamping ring}
- G01R 31/2831: {Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates (G01R31/318511 takes precedence; testing during manufacture H10P74/00)}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A semiconductor substrate (15) is placed into a recessed area (12) of a support structure (10). A ring (20) is then placed on the support structure (10) to form a wafer holder (30) which provides support to the semiconductor substrate (15) during handling, transporting, or electrical testing operations. The recessed area (12) can also have a vacuum opening (13) and a vacuum groove (17) so a vacuum pressure can be applied to the backside of semiconductor substrate (15). This will correct for any warpage or bowing in the semiconductor substrate (15) so a planar surface is formed for the electrical testing operation. The wafer holder (30) also has a flat (16) so the wafer holder (30) can be aligned and processed like a wafer with a diameter larger than the semiconductor substrate (15).

## Claims

### Claim 1

A wafer holder for semiconductor applications comprising:
a support structure having a patterned surface, a vacuum opening, and a vacuum wand slot extending into the support structure, the patterned surface having a recessed area and a vacuum groove intersecting the vacuum opening; and
a ring that attaches to the support structure such that at least a portion of the ring is overlying at least a portion of the patterned surface of the support structure and at least a central portion of the support structure is exposed.

### Claim 2 (depends on 1)

The wafer holder for semiconductor applications of claim 1, wherein the support structure and the ring have a combined thickness of 1.2 mm (50 mils) to 3.5 mm (140 mils).

### Claim 3 (depends on 1)

The wafer holder for semiconductor applications of claim 1, wherein the support structure is formed from a material selected from the group consisting of aluminum, aluminum alloy, nickel, quartz, platinum, stainless steel, titanium, copper, and gold.

### Claim 4 (depends on 1)

The wafer holder for semiconductor applications of claim 1, wherein the patterned surface of the support structure is plated with a material selected from the group consisting of aluminum, aluminum alloy, nickel, quartz, platinum, stainless steel, titanium, copper, and gold.

### Claim 5 (depends on 1)

The wafer holder for semiconductor applications of claim 1, wherein the ring is formed from a material selected from the group consisting of "Delrin", "Teflon", aluminum, aluminum alloy, nickel, quartz, platinum, stainless steel, titanium, copper, and gold.

### Claim 6 (depends on 1)

The wafer holder for semiconductor applications of claim 1, wherein the support structure has a flat.

### Claim 7

A method for probing a semiconductor substrate comprising the steps of:
providing the semiconductor substrate;
placing the semiconductor substrate into a support structure, the support structure having at least one vacuum opening;
placing a ring on the support structure such that the semiconductor substrate is held in contact with the support structure;
applying a vacuum through the at least one vacuum opening of the support structure; and
probing the semiconductor substrate.

### Claim 8 (depends on 7)

The method for probing the semiconductor substrate of claim 7, further comprising the step of electrically testing a semiconductor device on the semiconductor substrate through an opening in the ring.

### Claim 9 (depends on 7)

The method for probing the semiconductor substrate of claim 7, wherein the step of providing a semiconductor substrate includes providing a semiconductor substrate that has a thickness of 25 .mu.m (1 mil) to 250 .mu.m (10 mils).

### Claim 10 (depends on 7)

The method for probing the semiconductor substrate of claim 7, wherein the step of placing the semiconductor substrate into the support structure further comprises placing the semiconductor substrate into support structure with a vacuum wand and removing the vacuum wand through a vacuum wand slot in the support structure.

### Claim 11 (depends on 7)

The method for probing the semiconductor substrate of claim 7, wherein the step of placing the semiconductor substrate into the support structure includes aligning a flat on the semiconductor substrate to a flat on the support structure.

### Claim 12 (depends on 7)

The method for probing the semiconductor substrate of claim 7, wherein the step of placing a ring on the support structure forms a wafer holder that is 1.2 mm to 3.5 mm thick.

### Claim 13

A semiconductor wafer holder comprising a first portion and a second portion, the first portion having a recessed area for containing a semiconductor substrate and at least one vacuum opening to apply a vacuum to the semiconductor substrate, and the second portion attaches to the first portion to hold the semiconductor substrate in place and expose a portion of the semiconductor substrate.

### Claim 14 (depends on 13)

The semiconductor wafer holder of claim 13, wherein the first portion and the second portion form a wafer holder that is 1.2 mm to 3.5 mm thick.

### Claim 15 (depends on 13)

The semiconductor wafer holder of claim 13, wherein at least a portion of the first portion is plated with a material selected from the group consisting of aluminum, aluminum alloy, nickel, quartz, platinum, stainless steel, titanium, copper, and gold.

### Claim 16 (depends on 13)

The semiconductor wafer holder of claim 13, wherein the first portion and the second portion are formed from materials selected from the group consisting of "Delrin", "Teflon", aluminum, aluminum alloy, nickel, quartz, platinum, stainless steel, titanium, copper, and gold.

### Claim 17 (depends on 13)

The semiconductor wafer holder of claim 13, wherein the second portion further comprises a plurality of tabs used to hold the esmiconductor substrate.