# US 5,703,406 A · Interconnection structure for attaching a semiconductor device to a substrate

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- Number: US 5,703,406 A
- Document ID: US5703406A
- Status: Granted
- Kind: A
- Application number: 08/587,744
- Filed: 1996-01-19
- Granted: 1997-12-30
- Earliest claimed: 1995-09-22
- Assignees: LG Semicon Co., Ltd.
- Inventors: Dae Soon Kang
- Web page: https://patentgrep.com/patent/US5703406A

## CPC

- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 72/30: Die-attach connectors
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 72/072: {of bump connectors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/073: {of die-attach connectors}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/331: {Shapes of die-attach connectors}
- H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An interconnection structure for bonding a semiconductor device on a substrate includes a semiconductor chip having a plurality of solder balls attached thereto; and an under-fill substance layer being adjacently bonded to the semiconductor chip and having a plurality of holes therein. By employing the structure, when the semiconductor chip and the substrate are electrically bonded, a previously provided under fill substance layer is used without any additional under filling step, so that the entire process can be simplified and its reliability can be improved.

## Claims

### Claim 1

A module for mounting a semiconductor device on a substrate, the semiconductor device having a plurality of conductive media for conductive connection to the substrate, comprising:
an interconnection structure having a plurality of holes for receiving said plurality of conductive media to allow a conductive connection between the semiconductor device and the substrate, wherein said interconnection structure is in contact with said semiconductor device and the substrate to adhesively bond the semiconductor device to the substrate.

### Claim 2 (depends on 1)

The module of claim 1, wherein said plurality of conductive media is at least one of a plurality of solder balls and bumps.

### Claim 3 (depends on 1)

The module of claim 1, wherein said interconnection structure is an under-fill substance layer.

### Claim 4 (depends on 1)

The module of claim 1, wherein the substrate is a printed circuit board.

### Claim 5 (depends on 1)

The module of claim 1, wherein said interconnection structure has a width which is larger than that of the semiconductor device after the interconnection structure adhesively bonds the semiconductor device to the substrate.

### Claim 6 (depends on 1)

The module of claim 1, wherein a diameter of each of said plurality of holes is substantially the same as corresponding one of said plurality of conductive media such that said plurality of conductive media fits snugly into said plurality of holes.

### Claim 7 (depends on 1)

The module of claim 1, wherein each of said plurality of conductive media has first and second ends and said interconnection structure has first and second surfaces and said plurality of holes extend from said first surface to said second surface, and said plurality of conductive media is inserted through said plurality of holes from said first surface to said second surface such that said second ends of said plurality of conductive media extend beyond said second surface of the interconnection structure.

### Claim 8 (depends on 7)

The module of claim 7, wherein said first surface of said interconnection structure contacts the semiconductor device.

### Claim 9 (depends on 1)

The module of claim 1, wherein said plurality of holes have a round shape.