# US 5,703,401 A · Miniature semiconductor device for surface mounting

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- Number: US 5,703,401 A
- Document ID: US5703401A
- Status: Granted
- Kind: A
- Application number: 08/644,093
- Filed: 1996-05-10
- Granted: 1997-12-30
- Earliest claimed: 1995-05-10
- Assignees: U.S. Philips Corporation
- Inventors: Peter W. M. van de Water; Roelf A. J. Groenhuis; Cornelis G. Schriks
- Web page: https://patentgrep.com/patent/US5703401A

## CPC

- H10H 20/8506: {Containers}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 70/68: Shapes or dispositions thereof
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The invention relates to a semiconductor device for surface mounting with a substrate carrier having a surface provided with a groove with walls on which conductor tracks are present, which conductor tracks continue on the surface of the substrate carrier and form connection conductors of the device which is provided with a semiconductor element arranged in the groove with its main surface parallel to a wall which semiconductor element makes electrical contact with the conductor tracks on the wall, while the groove is filled with a protective material and the substrate carrier is provided with a side wall interconnecting mutually opposed walls of the groove on either side of the semiconductor element.

## Claims

### Claim 1

A semiconductor device for surface mounting, the semiconductor device being provided with a semiconductor element, the device comprising: a substrate carrier having a surface provided with a groove with walls on which conductor tracks are present, which conductor tracks continue onto the surface of the substrate carrier and form connection conductors of the device, the semiconductor element being arranged with its main surface parallel to a wall in said groove, and being in electrical contact with the conductor tracks on the wall, the groove being filled with a protective material, and the substrate carrier being provided with a side wall which mechanically interconnects and supports mutually opposed walls of the groove.

### Claim 2 (depends on 1)

A semiconductor device as claimed in claim 1, characterized in that the groove has no bottom.

### Claim 3

A semiconductor device as claimed in any one of the preceding claims, characterized in that the side wall is integral with the substrate carrier.

### Claim 4

A semiconductor device as claimed in any one of the preceding claims, characterized in that the substrate carrier is manufactured from a ceramic material or a synthetic resin.

### Claim 5

A carrier rod suitable for the manufacture of a semiconductor device for surface mounting with a surface, the carrier rod comprising a groove having walls on which conductor tracks are present, which conductor tracks continue onto the surface of the carrier rod, and the groove in the carrier rod being subdivided into compartments which are mutually separated by side walls.