# US 5,703,398 A · Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,703,398 A - Document ID: US5703398A - Status: Granted - Kind: A - Application number: 08/667,326 - Filed: 1996-06-20 - Granted: 1997-12-30 - Earliest claimed: 1993-03-17 - Assignees: Fujitsu Limited - Inventors: Michio Sono; Kazuto Tsuji; Hideharu Sakoda; Yoshimi Suzuki; Masao Sakuma - Web page: https://patentgrep.com/patent/US5703398A ## CPC - H10W 74/016: {using moulds} - H10W 40/778: {in encapsulations} - H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/753: {between laterally-adjacent chips} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor integrated circuit device includes a semiconductor chip supported by a stage, leads electrically connected to the semiconductor chip, first and second heat radiating members provided on first and second sides of the semiconductor chip, and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members. ## Claims ### Claim 1 A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; heat conducting supporting members, supporting the first and second heat radiating members away from the stage; and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members. ### Claim 2 (depends on 1) The semiconductor integrated circuit device as claimed in claim 1, wherein the first and second sides of the semiconductor device oppose each other. ### Claim 3 (depends on 1) The semiconductor integrated circuit device as claimed in claim 1, wherein each of the first and second heat radiating members has a plate shape. ### Claim 4 (depends on 1) The semiconductor integrated circuit device as claimed in claim 1, wherein a space between the first heat radiating member and the first side of the semiconductor chip is filled with resin of the resin package body, and a space between the second heat radiating member and the second side of the semiconductor chip is filled with resin of the resin package body. ### Claim 5 (depends on 1) The semiconductor integrated circuit device as claimed in claim 1, wherein the supporting members includes upper supporting members provided on the side of the first heat radiating member and lower supporting members provided on the side of the second heat radiating member. ### Claim 6 A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members; and supporting members supporting the first and second heat radiating members from the stage; wherein the supporting members include upper supporting members provided on the side of the first heat radiating member and lower supporting members provided on the side of the second heat radiating member; and wherein the stage and the lower supporting members are integrally formed. ### Claim 7 (depends on 1) The semiconductor integrated circuit device as claimed in claim 1, wherein a surface of the first heat radiating member is externally exposed, and a surface of the second heat radiating member is externally exposed. ### Claim 8 (depends on 1) The semiconductor integrated circuit device as claimed in claim 1, wherein the stage has a length greater than that of the semiconductor chip. ### Claim 9 A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members; and a relay member having terminals, and wherein the leads are electrically connected to the semiconductor chip via the terminals of the relay member. ### Claim 10 (depends on 9) The semiconductor integrated circuit device as claimed in claim 9, wherein the relay member is mounted on the stage so that the relay member surrounds sides of the semiconductor chip. ### Claim 11 (depends on 9) The semiconductor integrated circuit device as claimed in claim 9, further comprising first wires connecting the leads to the terminals of the relay member and second wires connecting the terminals to the semiconductor chip. ### Claim 12 (depends on 1) The semiconductor integrated circuit device as claimed in claim 1, wherein said supporting members include calk members. ### Claim 13 (depends on 1) The semiconductor integrated circuit device of claim 1, wherein said heat conducting supporting members are supporting bars. ### Claim 14 (depends on 1) The semiconductor integrated circuit device of claim 1, wherein said heat conducting supporting members are made of metal. ### Claim 15 (depends on 14) The semiconductor integrated circuit device of claim 14, wherein said heat conducting supporting members include Ni-Fe.