# US 5,703,394 A · Integrated electro-optical package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,703,394 A - Document ID: US5703394A - Status: Granted - Kind: A - Application number: 08/660,829 - Filed: 1996-06-10 - Granted: 1997-12-30 - Earliest claimed: 1996-06-10 - Assignees: Motorola, Inc. - Inventors: Chengping Wei; Song Q. Shi; Hsing-Chung Lee - Web page: https://patentgrep.com/patent/US5703394A ## CPC - H10W 90/00: Package configurations - H10K 59/179: Interconnections, e.g. wiring lines or terminals - H10K 59/8721: {Metallic sealing arrangements} - H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices. ## Claims ### Claim 1 An integrated electro-optical package comprising: a supporting substrate defining a plurality of pixels; a printed circuit board containing thereon at least one driver and control circuit and having formed therein a plurality of plated through hole vias; a conductive epoxy, positioned to directly interconnect the plurality of plated through hole vias to the plurality of pixels, thereby electrically interfacing the plurality of pixels formed on the supporting substrate with the at least one driver and control circuit; and a sealant positioned to hermetically seal the supporting substrate about a perimeter, to the printed circuit board. ### Claim 2 (depends on 1) An integrated electro-optical package as claimed in claim 1 wherein the supporting substrate has formed thereon a plurality of electrically conductive strips, a layer of organic electroluminescent medium, and a plurality of metallized strips, thereby defining the plurality of pixels. ### Claim 3 (depends on 2) An integrated electro-optical package as claimed in claim 2 wherein the plurality of electrically conductive strips are formed of indium-tin-oxide (ITO). ### Claim 4 (depends on 3) An integrated electro-optical package as claimed in claim 3 wherein the plurality of metallized strips are formed of one of a low work function metal and metal alloy capped with a stable metal. ### Claim 5 (depends on 2) An integrated electro-optical package as claimed in claim 2 wherein the organic electroluminescent medium is comprised of a layer of hole transporting material, a layer of active emitter material, and a layer of electron transporting material. ### Claim 6 (depends on 1) An integrated electro-optical package as claimed in claim 1 wherein the printed circuit board is a multi-layer printed circuit board containing alternating layers of FR4 board and circuit routing layers. ### Claim 7 (depends on 6) An integrated electro-optical package as claimed in claim 6 wherein the plurality of plated through hole vias serve as a plurality of vertical interconnections to electrically interface an end of each of the plurality of electrically conductive strips and an end of each of the plurality of metallized strips to the at least one driver and control circuit. ### Claim 8 (depends on 7) An integrated electro-optical package as claimed in claim 7 wherein the conductive epoxy is formed in bumps. ### Claim 9 (depends on 7) An integrated electro-optical package as claimed in claim 7 wherein the conductive epoxy includes a layer of z-axis conductive epoxy. ### Claim 10 An integrated electro-optical package comprising: a supporting substrate; a first layer of conductive material patterned on the supporting substrate: a continuous layer of organic material overlying the first layer of conductive material; a second layer of conductive material patterned orthogonal to the first layer of conductive material and overlying the continuous layer of organic material, thereby defining a plurality of pixels of an organic light emitting device; a printed circuit board positioned to overlay the second layer of conductive material, and containing thereon at least one driver and control circuit and having formed therein a plurality of plated through hole vias; a conductive epoxy, positioned to electrically interconnect the plurality of pixels defined by the first layer of conductive material and the second layer of conductive material with the at least one driver and control circuit; and a sealant positioned to hermetically seal the organic light emitting device to the printed circuit board. ### Claim 11 (depends on 10) An integrated electro-optical package as claimed in claim 10 wherein the first layer of conductive material patterned on the supporting substrate further defines a plurality of electrically conductive strips. ### Claim 12 (depends on 11) An integrated electro-optical package as claimed in claim 11 wherein the second layer of conductive material patterned orthogonal to the first layer of conductive material defines a plurality of metallized strips. ### Claim 13 (depends on 12) An integrated electro-optical package as claimed in claim 12 wherein the plurality of electrically conductive strips are formed of indium-tin-oxide (ITO). ### Claim 14 (depends on 10) An integrated electro-optical package as claimed in claim 10 wherein the plurality of metallized strips are formed of one of a low work function metal and a metal alloy, capped with a stable metal. ### Claim 15 (depends on 10) An integrated electro-optical package as claimed in claim 10 wherein the continuous layer of organic material is comprised of a layer of hole transporting material, a layer of active emitter material, and a layer of electron transporting material. ### Claim 16 (depends on 10) An integrated electro-optical package as claimed in claim 10 wherein the printed circuit board is a multi-layer printed circuit board. ### Claim 17 (depends on 10) An integrated electro-optical package as claimed in claim 10 wherein the plurality of plated through hole vias serve as a plurality of vertical interconnections to electrically interface an end of each of the plurality of electrically conductive strips and an end of each of the plurality of metallized strips to the at least one driver and control circuit, thereby providing for a multiscan driving scheme. ### Claim 18 (depends on 10) An integrated electro-optical package as claimed in claim 10 wherein the conductive epoxy is formed in bumps. ### Claim 19 (depends on 10) An integrated electro-optical package as claimed in claim 10 wherein the conductive epoxy includes a layer of z-axis conductive epoxy.