# US 5,703,393 A · Semiconductor pressure detecting device and manufacturing method of the device

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- Number: US 5,703,393 A
- Document ID: US5703393A
- Status: Granted
- Kind: A
- Application number: 08/543,439
- Filed: 1995-10-16
- Granted: 1997-12-30
- Earliest claimed: 1995-06-27
- Assignees: Mitsubishi Denki Kabushiki Kaisha
- Inventors: Yasuo Yamaguchi
- Web page: https://patentgrep.com/patent/US5703393A

## CPC

- G01L 19/0084: {to the outside of the housing (other details about the housing see G01L19/14)}
- G01L 19/147: {Details about the mounting of the sensor to support or covering means}
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)

## Abstract

A semiconductor pressure detecting in which a pressure sensing element (2) made of semiconductor having a diaphragm portion (9), a pedestal (8) for supporting the pressure sensing element (2) and wires (5) connected to the pressure sensing element (2) are molded by a molding resin (6) not so as to mold the diaphragm portion (9), characterized in that a silicon resin layer (4) is adhered on an outer surface of the diaphragm portion (9).

## Claims

### Claim 1

A semiconductor pressure detecting device comprising:
a semiconductor pressure sensing element including a diaphragm portion;
a pedestal supporting said semiconductor pressure sensing element;
at least one wire connected to said semiconductor pressure sensing element;
a molding resin adhesion prevention member including a silicone resin layer adhered on a whole outer surface of said semiconductor pressure sensing element so as to prevent molding resin from contacting said diaphragm portion during molding of said semiconductor pressure sensing element, said pedestal, and said at least one wire.

### Claim 2

A semiconductor pressure detecting device comprising:
a semiconductor pressure sensing element including a diaphragm portion;
a pedestal supporting said semiconductor pressure sensing element;
at least one wire connected to said semiconductor pressure sensing element;
a molding resin adhesion prevention member including a silicone resin layer adhered on an outer surface of said diaphragm portion so as to prevent molding resin from contacting said diaphragm portion during molding of said semiconductor pressure sensing element, said pedestal, and said at least one wire.

### Claim 3 (depends on 2)

The semiconductor pressure detecting device recited in claim 2, further comprising:
a coating layer applied on an outer surface of said semiconductor pressure sensing element excluding said diaphragm portion.

### Claim 4 (depends on 3)

The semiconductor pressure detecting device recited in claim 3, wherein said coating layer is made of glass.

### Claim 5 (depends on 1)

A semiconductor pressure detecting device as defined in claim 1, wherein said silicone resin layer is elastic.

### Claim 6 (depends on 2)

A semiconductor pressure sensing device as defined in claim 2, wherein said silicone resin layer is elastic.