# US 5,703,195 A · Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives

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- Number: US 5,703,195 A
- Document ID: US5703195A
- Status: Granted
- Kind: A
- Application number: 08/757,187
- Filed: 1996-11-27
- Granted: 1997-12-30
- Earliest claimed: 1995-06-07
- Assignees: National Starch and Chemical Investment Holding Corporation
- Inventors: Rose Ann Schultz; Steven P. Fenelli
- Web page: https://patentgrep.com/patent/US5703195A

## CPC

- C07D 303/22: with monohydroxy compounds
- C07D 303/24: with polyhydroxy compounds
- C08G 59/245: {aromatic}
- C08G 59/28: containing acyclic nitrogen atoms
- C08G 59/32: Epoxy compounds containing three or more epoxy groups
- C08G 59/3218: {Carbocyclic compounds}
- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- H10W 70/417: {Bonding materials between chips and die pads}
- H10W 72/30: Die-attach connectors
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10W 72/073: {of die-attach connectors}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- Y10T 428/12528: Semiconductor component
- C07D: HETEROCYCLIC COMPOUNDS (macromolecular compounds C08)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities. The flexible epoxy resins are used in adhesives for microelectronic applications.

## Claims

### Claim 1

A flexible epoxy compound, characterized in that it has a total chlorine content of less than 0.1% by weight, having the structural formula: ##STR21## in which: R' is H, C.sub.1-18 alkyl, C.sub.1-5 alkoxy or aryl or alkylaryl, C.sub.1-5 perfluoroalkyl, or C.sub.1-5 acyl; and
n is an integer 1-3; and
p is an integer 6-16.

### Claim 2 (depends on 1)

A flexible epoxy compound according to claim 1 having the structure: ##STR22##

### Claim 3 (depends on 1)

An adhesive for use in microelectronics applications containing a flexible epoxy compound according to claim 1.