# US 5,703,139 A · Photo-curable resin composition and product coated therewith > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,703,139 A - Document ID: US5703139A - Status: Granted - Kind: A - Application number: 08/534,719 - Filed: 1995-09-27 - Granted: 1997-12-30 - Earliest claimed: 1994-09-27 - Assignees: Hanwha Chemical Corporation - Inventors: Sang-Keun Kim; Seoung-Ho Kim; Haeng-Woo Lee; Cheol-Kyu Choi; Jeong-Deuk Kim; Jin-Who Hong; Chang-Soo Kim; Kong-Hyun Whang - Web page: https://patentgrep.com/patent/US5703139A ## CPC - C09D 4/00: Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16} - C08F 22/1006: {of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate} - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS ## Abstract The present invention relates to a photo-curable resin composition which shows an excellent antistatic property and staining resistance by introducing aliphatic trifunctional urethane acrylate prepolymer therein and to a product coated with said resin composition. Specifically, the photo-curable resin composition according to the present invention are useful for coating a product made from metacrylate resin, vinylchloride resin, ABS resin or carbonate resin. The photo-curable resin composition according to the present invention can comprise reactive diluent, photoinitiator and additives in addition to said prepolymer. ## Claims ### Claim 1 A photo-curable resin composition comprising a prepolymer having the following formula (I): ##STR7## in which W represents ##STR8## R.sub.1 represents hydrogen or methyl; R.sub.1 ' represents ##STR9## wherein X represents a chlorine or bromine atom, R.sub.2 represents methyl or ethyl, n, o and q independently of one another denote an integer of 1 to 6 and p denotes an integer of 0 to 6; R.sub.2 ' and R.sub.3 ' are identical to or different from each other and represent ##STR10## wherein L denotes an integer of 0 to 5, or ##STR11## wherein m denotes an integer of 1 to 6; a, b and c independently of one another represent a real number of 3 or less, provided that they satisfy the conditions of 0<a.ltoreq.3, 0.ltoreq.b<3 and 0.ltoreq.c<3 and a+b+c=3. ### Claim 2 (depends on 1) The photo-curable resin composition according to claim 1, wherein the composition further comprises a reactive diluent and a photoinitiator. ### Claim 3 (depends on 2) The photo-curable resin composition according to claim 2, comprising 5 to 70 parts by weight of the prepolymer having the formula (I), 30 to 90 parts by weight of the reactive diluent and 1 to 5 parts by weight of the photoinitiator are used with respect to 100 parts by weight of the resin composition. ### Claim 4 (depends on 3) The photo-curable resin composition according to claim 3, wherein said reactive diluent is one or more selected from the group consisting of hydroxyethyl acrylate, hydroxypropyl acrylate, hexanediol diacrylate, tripropyleneglycol diacrylate and trimethylolpropane triacrylate. ### Claim 5 (depends on 3) The photo-curable resin composition according to claim 3, wherein said photoinitiator is at least one of 1-hydroxycyclohexylphenyl ketone and/or 2-hydroxy-2-methyl-1-phenylpropan-1-one. ### Claim 6 (depends on 3) The photocurable composition of claim 3, further comprising 0.1 to 2 parts by weight at a leveling agent. ### Claim 7 (depends on 6) The photocurable composition of claim 6, wherein said reactive diluent is at least one selected from the group consisting of hydroxyethyl acrylate, hydroxypropyl acrylate, hexanediol diacrylate, tripropyleneglycol diacrylate and trimethylolpropane triacrylate. ### Claim 8 (depends on 2) The photo-curable resin composition according to claim 2, wherein said reactive diluent is at least one selected from the group consisting of hydroxyethyl acrylate, hydroxypropyl acrylate, hexanediol diacrylate, tripropyleneglycol diacrylate and trimethylolpropane triacrylate. ### Claim 9 (depends on 2) The photo-curable resin composition according to claim 2, wherein said photoinitiator is at least one of 1-hydroxycyclohexylphenyl ketone and 2-hydroxy-2-methyl-1-phenylpropan-1-one. ### Claim 10 (depends on 2) A product prepared by coating methylmetacrylate resin, vinylchloride resin, ABS resin or carbonate resin with the photo-curable resin composition as defined in claim 2 in the thickness of 1 to 100 .mu.m and then photo curing sid photo-curable resin composition. ### Claim 11 (depends on 3) The photocurable composition of claim 3, further comprising at least one of a thickener and a leveling agent. ### Claim 12 (depends on 11) The photocurable composition of claim 11, wherein said reactive diluent is at least one selected from the group consisting of hydroxyethyl acrylate, hydroxypropyl acrylate, hexanediol diacrylate, tripropyleneglycol diacrylate and trimethylolpropane triacrylate. ### Claim 13 (depends on 1) A product prepared by coating methylmethacrylate resin, vinylchloride resin, ABS resin or carbonate resin with the photo-curable resin composition as defined in claim 1 in the thickness of 1 to 100 .mu.m and then photo curing said photo-curable resin composition.