# US 5,702,862 A · Positive photoresist coating solution comprising a mixed solvent of propylene glycol monopropyl ether and 2-heptanone

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- Number: US 5,702,862 A
- Document ID: US5702862A
- Status: Granted
- Kind: A
- Application number: 08/797,663
- Filed: 1997-01-31
- Granted: 1997-12-30
- Earliest claimed: 1996-02-02
- Assignees: Tokyo Ohka Kogyo Co., Ltd.
- Inventors: Hayato Ohno; Taku Nakao; Hisanobu Harada; Shinichi Hidesaka; Hidekatsu Kohara; Toshimasa Nakayama
- Web page: https://patentgrep.com/patent/US5702862A

## CPC

- G03F 7/0048: {characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents}
- G03F 7/022: Quinonediazides (G03F7/075 takes precedence)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A positive photoresist coating solution comprising (a) an alkali-soluble resin, (b) a quinone diazide group-containing compound, and (c) an organic solvent in an amount sufficient for dissolving said (a) and (b) components, wherein said organic solvent contains (i) propylene glycol monopropyl ether and (ii) 2-heptanone. The solution of the present invention exhibits excellent coating ability, sensitivity, thermostability, focal depth range, shape-profiling ability, and the like.

## Claims

### Claim 1

A positive photoresist coating solution comprising (a) an alkali-soluble resin, (b) a quinone diazide group-containing compound, and (c) an organic solvent in an amount sufficient for dissolving said (a) and (b) components, wherein said organic solvent contains (i) propylene glycol monopropyl ether and (ii) 2-heptanone.

### Claim 2 (depends on 1)

The positive photoresist coating solution according to claim 1, wherein 5 to 100% by weight of said (b) quinone diazide group-containing compound relative to said (a) alkali-soluble resin is used.

### Claim 3 (depends on 1, 2)

The positive photoresist coating solution according to claim 1 or 2, wherein said organic solvent contains (i) 10 to 60% by weight of propylene glycol monopropyl ether and (ii) 40 to 90% by weight of 2-heptanone.

### Claim 4 (depends on 1, 2)

The positive photoresist coating solution according to claim 1 or 2, wherein said alkali-soluble resin is selected from a condensation product of a phenol compound with an aldehyde compound, or a phenol compound with a ketone compound; and polyhydroxystyrene, and derivatives thereof.

### Claim 5 (depends on 4)

The positive photoresist coating solution according to claim 4, wherein said condensation product has a weight average molecular weight of 2,000 to 20,000.

### Claim 6 (depends on 4)

The positive photoresist coating solution according to claim 4, wherein said (a) alkali-soluble resin is a cresol-novolak resin.

### Claim 7 (depends on 1, 2)

The positive photoresist coating solution according to claim 1 or 2, wherein said quinone diazide group-containing compound is a completely or partially esterified compound of a polyhydroxy compound with naphthoquinone-1,2-diazide-5-sulfonic acid or naphthoquinone-1,2-diazide-4-sulfonic acid.

### Claim 8 (depends on 7)

The positive photoresist coating solution according to claim 7, wherein said quinone diazide group-containing compound is a completely or partially esterified compound of a polyhydroxy compound having a molecular weight of 600 or less with naphthoquinone-1,2-diazide-5-sulfonic acid or naphthoquinone-1,2-diazide-4-sulfonic acid.

### Claim 9 (depends on 1, 2)

The positive photoresist coating solution according to claim 1 or 2, wherein a phenol compound having a molecular weight of 600 or less is further added to the solution.