# US 5,702,861 A · Positive photoresist composition

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- Number: US 5,702,861 A
- Document ID: US5702861A
- Status: Granted
- Kind: A
- Application number: 08/791,166
- Filed: 1997-01-30
- Granted: 1997-12-30
- Earliest claimed: 1996-01-30
- Assignees: Tokyo Ohka Kogyo Co., Ltd.
- Inventors: Satoshi Niikura; Takako Suzuki; Kousuke Doi; Hidekatsu Kohara; Toshimasa Nakayama
- Web page: https://patentgrep.com/patent/US5702861A

## CPC

- G03F 7/0226: {characterised by the non-macromolecular additives}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A positive photoresist composition comprising: (A) an alkali-soluble resin; (B) a quinone diazide group-containing compound; and (C) at least one compound selected from the polyhydroxy compounds, such as 1,3-bis›2-(5-cyclohexyl-2-methyl-4-hydroxyphenyl)-2-propyl!benzene. The composition of the present invention exhibits excellent image contrast between exposed portions and unexposed portions, and actualizes formation of a resist pattern with excellent resolution, exposure range, and focal depth range.

## Claims

### Claim 1

A positive photoresist composition comprising:
(A) an alkali-soluble resin;
(B) a quinone diazide group-containing compound; and
(C) at least one compound selected from the polyhydroxy compounds expressed by the following general formula (I), ##STR6## wherein each of R.sup.1 and R.sup.2 is independently selected from a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and a halogen atom.

### Claim 2 (depends on 1)

The positive photoresist coating composition according to claim 1, wherein 5 to 100% by weight of said (B) quinone diazide group-containing compound relative to said (A) alkali-soluble resin is used.

### Claim 3 (depends on 1, 2)

The positive photoresist composition according to claim 1 or 2, wherein each of R.sup.1 and R.sup.2 in the above general formula (I) is independently selected from a hydrogen atom, and an alkyl group having 1 to 6 carbon atoms.

### Claim 4 (depends on 3)

The positive photoresist composition according to claim 3, wherein R.sup.1 is a methyl group and R.sup.2 is a hydrogen atom.

### Claim 5 (depends on 1, 2)

The positive photoresist composition according to claim 1 or 2, wherein the content of the ingredient (C) is 0.1 to 15% by weight relative to the ingredient (A).

### Claim 6 (depends on 1, 2)

The positive photoresist composition according to claim 1 or 2, wherein the content of the ingredient (C) is 0.2 to 8% by weight relative to the ingredient (A).

### Claim 7 (depends on 1)

The positive photoresist composition according to claim 1, wherein the ingredient (A) comprises a novolak resin.

### Claim 8

The positive photoresist composition according claim further comprising at least one compound selected from:
hydroxyaryl compounds expressed by the following formula (II), ##STR7## wherein each of R.sup.3 to R.sup.5 is independently selected from a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; each of R.sup.6 to R.sup.11 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an alkenyl group having 2 to 4 carbon atoms, and a cycloalkyl group having 5 to 8 carbon atoms; each of R.sup.12 and R.sup.13 is independently selected from a hydrogen atom, a halogen atom, and an alkyl group having 1 to 4 carbon atoms; each of x, y, and z is an integer independently selected from 1, 2, and 3; and n' is 0 or 1; and,
hydroxyaryl compounds expressed by the following formula (III), ##STR8## wherein each of R.sup.14 to R.sup.17 is independently selected from a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; each of R.sup.18 to R.sup.22 is independently selected from a hydrogen atom, a halogen atom, and an alkyl or alkoxy group having 1 to 4 carbon atoms; and each of l', m', x' and y' is an integer independently selected from 1, 2, and 3.

### Claim 9 (depends on 8)

The positive photoresist composition according to claim 8, wherein 5 to 50% by weight of said hydroxyaryl compounds relative to said (A) alkali-soluble resin is used.