# US 5,702,533 A · Particulate free vacuum compatible pinch seal > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,702,533 A - Document ID: US5702533A - Status: Granted - Kind: A - Application number: 08/672,317 - Filed: 1996-06-28 - Granted: 1997-12-30 - Earliest claimed: 1996-06-28 - Assignees: Lam Research Corporation - Inventors: Randall S. Mundt; Kenneth R. Krieg - Web page: https://patentgrep.com/patent/US5702533A ## CPC - C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases} - H10P 72/3204: {using magnetic elements} - Y10S 414/135: Associated with semiconductor wafer handling - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract A pinch seal in which particle generation by frictional contact is prevented so that the pinch seal can be used in a semiconductor processing apparatus where elimination of particulate contamination is desirable. The pinch seal is particularly adapted for use in connection with a semiconductor wafer transport device, such as a linear transport device. The pinch seal is formed in a barrier provided between a transport device and a semiconductor processing work environment. One or more support members for transporting a wafer extend through the pinch seal. In one embodiment, the pinch seal includes a flexible sealing member with a magnetic strip extending along the length of the flexible sealing member. A mechanism which does not physically contact the flexible sealing member, such as a device generating a magnetic field, is used to selectively open and close the flexible sealing member to prevent contact between the flexible sealing member and the support member passing through the flexible sealing member while retaining the isolating function of the shielding member. ## Claims ### Claim 1 A semiconductor processing device comprising: a transport device which transports a substrate within a work environment, the transport device including a transport mechanism and a substrate supporting member attached to the transport mechanism; a barrier separating the work environment from the transport mechanism of the transport device, the barrier having an elongated opening through which the substrate supporting member extends; a flexible seal sealing the elongated opening in the barrier while allowing the substrate supporting member to move along the elongated opening, the flexible seal being effective to minimize particles from passing through the opening into the work environment; and an opening device which opens the flexible seal, the opening device preventing contact between the flexible seal and the substrate supporting member while the substrate supporting member moves along the opening. ### Claim 2 (depends on 1) The semiconductor processing device according to claim 1, wherein the opening device is attached to the substrate supporting member and moves along with the substrate supporting member. ### Claim 3 (depends on 1) The semiconductor processing device according to claim 1, wherein the flexible seal includes a magnetic material and the opening device includes a magnet, the magnet interacting with the magnetic material so as to open or close the flexible seal at a localized area adjacent the magnet. ### Claim 4 (depends on 3) The semiconductor processing device according to claim 3, wherein the magnetic material is a strip of magnetic material attached to an edge of the flexible seal. ### Claim 5 (depends on 3) The semiconductor processing device according to claim 3, wherein the magnet comprises an electromagnet. ### Claim 6 (depends on 1) The semiconductor processing device according to claim 1, wherein the opening device prevents sliding contact between the flexible seal and the substrate supporting member. ### Claim 7 (depends on 1) The semiconductor processing device according to claim 1, wherein the opening device is located so as to precede a leading edge of the substrate supporting member in a direction of travel of the substrate supporting member. ### Claim 8 (depends on 1) The semiconductor processing device according to claim 1, further comprising a closing device which closes the flexible seal, the closing device being located so as to follow a trailing edge of the substrate supporting member in a direction of travel of the substrate supporting member. ### Claim 9 (depends on 1) The semiconductor processing device according to claim 1, wherein the substrate supporting member supports a semiconductor wafer in a particle-free vacuum environment and the opening device operates to open the flexible seal in conjunction with movement of the substrate supporting member along the elongated opening. ### Claim 10 A sealing device comprising: a flexible sealing member positioned in an elongated opening in a barrier wall for preventing particles from passing through the elongated opening; a support member extending through the elongated opening and mounted for movement along a length of the elongated opening; and an opening device attached to the support member for opening the flexible sealing member, the opening device preventing contact between the flexible seal and the support member as the support member moves along the length of the opening while providing an effective particle barrier. ### Claim 11 (depends on 10) The sealing device according to claim 10, wherein the flexible sealing member is a resilient strip which includes a strip of a magnetic material, and the opening device includes a magnet. ### Claim 12 (depends on 11) The sealing device according to claim 11, wherein the opening device is located to precede a leading edge of the support member in a direction of travel of the support member. ### Claim 13 (depends on 11) The sealing device according to claim 11, further comprising a closing device for closing the flexible sealing member, the closing device located to follow a trailing edge of the support member in a direction of travel of the support member. ### Claim 14 (depends on 11) The sealing device according to claim 11, wherein the support member supports, a semiconductor wafer in a particle-free vacuum environment and the opening device operates to open the flexible sealing member in conjunction with movement of the support member along the elongated opening. ### Claim 15 (depends on 10) The sealing device according to claim 10, wherein the opening device comprises an electromagnet. ### Claim 16 A method of shielding a substrate from non-localized particle sources comprising: providing a substrate in a working environment separated from an actuating mechanism by a shielding member, the actuating mechanism moving a member supporting the substrate while the member extends through an elongated flexible seal sealing an elongated opening in the shielding member; forming an open area around the member by selectively opening and closing portions of the elongated flexible seal while moving the member along the opening through the open area in the flexible seal; and reducing particle generation by preventing contact between the flexible seal and the member moving through the open area in the flexible seal while retaining the isolating function of the shielding member. ### Claim 17 (depends on 16) The method of claim 16, wherein the member supports a semiconductor wafer in a particle-free vacuum environment. ### Claim 18 (depends on 16) The method of claim 16, wherein the open area is formed by a magnetic field. ### Claim 19 (depends on 16) The method of claim 16, wherein the flexible seal is biased so as to seal the opening and the open area is formed by a mechanism which does not physically contact the flexible seal.