# US 5,700,627 A · Device for the insolation of micrometric and/or submicrometric areas in a photosensitive layer and a method for the creation of patterns in such a layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,700,627 A - Document ID: US5700627A - Status: Granted - Kind: A - Application number: 08/696,716 - Filed: 1996-08-14 - Granted: 1997-12-23 - Earliest claimed: 1995-08-17 - Assignees: Commissariat a l'Energie Atomique - Inventors: Michel Ida; Robert Baptist - Web page: https://patentgrep.com/patent/US5700627A ## CPC - G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) - B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites - G03F 7/70383: {Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams (maskless lithography using a programmable mask G03F7/70291)} - H01J 9/025: {of field emission cathodes} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract A device for insolating micrometric areas in a photosensitive layer and a method for producing patterns in such a layer. The method is characterized in that the layer is subjected to an atmosphere containing a transparent liquid that does not wet the photosensitive material, in order to produce on this layer a monolayer of micro-droplets (121), the layer of photosensitive material is insolated through the monolayer of micro-droplets (121) in order to selectively print the areas of exposure (122) of the layer, the micro-droplets (121) are removed, and the layer of photosensitive material is developed in order to form said patterns in accordance with the areas of exposure. ## Claims ### Claim 1 A method of producing micrometric or submicrometric patterns in a layer of photosensitive material positioned on a substrate comprising the steps of: subjecting the layer to an atmosphere containing liquid that does not wet the photosensitive material in a manner that produces a monolayer of micro-droplets of the non-wetting liquid on this layer, the photosensitive material layer being kept at a temperature sufficiently low to prevent the coalescence of the micro-droplets with one another, insolating the layer of photosensitive material through the monolayer of micro-droplets to selectively print areas of exposure of the photosensitive layer with an insolation light, removing the micro-droplets, developing the layer of photosensitive material to form micrometric or submicrometric patterns in accordance with the areas of exposure, wherein the non-wetting liquid is transparent to the insolation light, each micro-droplet focusing the light in said areas of exposure. ### Claim 2 (depends on 1) A method according to claim 1, wherein the layer of photosensitive material is insolated with the insolation light sufficiently intense to print the photosensitive material in the areas of exposure in which the micro-droplets focus said light, and sufficiently weak to not print the photosensitive material outside the areas of exposure. ### Claim 3 (depends on 1) A method according to claim 1, wherein the layer of photosensitive material is a positive resin. ### Claim 4 (depends on 3) A method according to claim 3, wherein during development the photosensitive material is removed from the areas of exposure. ### Claim 5 (depends on 1) A method according to claim 1, wherein the layer of photosensitive material is a negative resin. ### Claim 6 (depends on 1) A method according to claim 1, wherein during the development of the photosensitive material, the photosensitive material is removed outside the areas of exposure while retaining the material in the areas of exposure. ### Claim 7 (depends on 1) A method according to claim 1, wherein the non-wetting liquid is water. ### Claim 8 (depends on 1) A method according to claim 1, wherein the atmosphere containing the non-wetting liquid is formed with an atomizer capable of forming graded micro-droplets. ### Claim 9 (depends on 8) A method according to claim 8, wherein an ultra-sonic atomizer is used. ### Claim 10 (depends on 8) A method according to claim 8, wherein an pneumatic atomizer is used. ### Claim 11 (depends on 1) A method according to claim 1, wherein the atmosphere containing the non-wetting liquid is formed with a generator of vapor from the liquid. ### Claim 12 (depends on 1) A method according to claim 1, wherein the layer of photosensitive material is insolated through a mask positioned between a source of insolation radiation and the monolayer of micro-droplets, this mask having openings corresponding to regions of the layer of photosensitive material to be insolated. ### Claim 13 (depends on 1) A method according to claim 1, wherein the patterns are openings going through the layer of photosensitive material. ### Claim 14 (depends on 1) A method of manufacturing a micro-point cathode electron source comprising the steps of: forming a structure including cathode conductors on a substrate, forming an electrically insulating layer on the cathodic conductors, and forming grids on the electrically insulating layer which make an angle with the cathodic conductors, forming holes through the grids and the insulating layer in areas where the grids cross the cathodic conductors, forming micro-points of electron emitting material in the holes, on the cathodic conductors, wherein the holes are obtained by forming a layer of positive photosensitive resin at least in said areas, at a surface of the structure, by forming openings in the layer of the resin in accordance with the method according to claim 1 and by etching the grids and the insulating layer through the openings formed in the resin layer.