# US 5,700,560 A · Gas barrier resin composition and its film and process for producing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,700,560 A - Document ID: US5700560A - Status: Granted - Kind: A - Application number: 08/416,380 - Filed: 1995-04-04 - Granted: 1997-12-23 - Earliest claimed: 1992-07-29 - Assignees: Sumitomo Chemical Company, Limited - Inventors: Kozo Kotani; Toshio Kawakita; Taiichi Sakaya; Toshiya Kuroda - Web page: https://patentgrep.com/patent/US5700560A ## CPC - C08K 7/00: Use of ingredients characterised by shape - B32B 27/18: characterised by the use of special additives - C08K 3/346: {Clay} - C08K 2201/008: Additives improving gas barrier properties - C08K 2201/016: Additives defined by their aspect ratio - Y10T 428/252: Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.] - Y10T 428/259: Silicic material - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A gas barrier resin composition or its film having very high level gas barrier and moisture barrier properties, which includes at least a high hydrogen-bonding resin and a non-film-forming inorganic laminar compound having a particle size of 5 .mu.m and an aspect ratio of 50-5,000. The resin composition or its film can be produced by dispersing a non-film-forming inorganic laminar compound in a high hydrogen-bonding resin or resin solution in such a state that the non-film-forming inorganic laminar compound is swollen or cloven with a solvent, and removing the solvent from the dispersion, if necessary in the form of a film, while maintaining the state. ## Claims ### Claim 1 A resin composition comprising a high hydrogen-bonding resin containing from 20 wt % to 60 wt % of a hydrogen-bonding group or ionic group based on a total weight of the hydrogen-bonding resin, and a non-film-forming clay mineral having a swellability, the resin composition having a volume ratio of the clay mineral to the hydrogen-bonding resin in the range of 5:95 to 90:10, wherein the clay mineral has an aspect ratio of in a range of from 50 to 5000. ### Claim 2 (depends on 1) The resin composition according to claim 1, wherein the aspect ratio of the clay mineral is in a range of from 200 to 3,000. ### Claim 3 (depends on 1) The resin composition according claim 1, wherein the weight percentage of the hydrogen-bonding group or ionic group per unit weight of the hydrogen-bonding resin is in the range of 30-50%. ### Claim 4 (depends on 1) The resin composition according to claim 1, wherein the high hydrogen-bonding resin is polyvinyl alcohol or a polysaccharide. ### Claim 5 (depends on 1) The resin composition according to claim 1, which further contains a cross-linking agent for the hydrogen-bonding group of the hydrogen-bonding resin. ### Claim 6 (depends on 5) The resin composition according to claim 5, wherein the cross-linking agent is a compound containing zirconium. ### Claim 7 (depends on 1, 2, 3, 4, 5) A laminated film or laminate having at least one layer formulated from the composition claimed in claim 1, 2, 3, 4, 5, or 6. ### Claim 8 (depends on 1, 2, 3, 4, 5) A laminated film or laminate comprising: at least one layer selected from the group consisting of a biaxially oriented polypropylene film, a biaxially oriented nylon film and a biaxially oriented polyethylene terephthalate film; and at least one layer formulated from the composition claimed in claim 1, 2, 3, 4, 5, or 6. ### Claim 9 (depends on 1) The resin composition according to claim 1, wherein the clay mineral is selected from the group consisting of montmorillonite, hectorite, sodium terasililic mica, sodium taeniolite, and any combination thereof. ### Claim 10 A water-resistant gas-barrier film formulated at least from a resin composition, said resin composition comprising a high hydrogen-bonding resin containing from 20 wt % to 60 wt % of a hydrogen-bonding group or ionic group based on a total weight of the hydrogen-bonding resin, and a non-film-forming clay mineral having a swellability, the resin composition having a volume ratio of the clay mineral to the hydrogen-bonding resin in the range of 5:95 to 90:10 wherein the clay mineral has an aspect ratio of in a range of from 50 to 5000. ### Claim 11 (depends on 10) A water-resistant gas-barrier film according to claim 10, wherein the aspect ratio of the clay mineral is in a range of from 200 to 3,000. ### Claim 12 (depends on 10) A water-resistant gas-barrier film according to claim 10, wherein the weight percentage of the hydrogen-bonding group or ionic group per unit weight of the hydrogen-bonding resin is in the range of 30-50%. ### Claim 13 (depends on 10) A water-resistant gas-barrier film according to claim 10, wherein the high hydrogen-bonding resin is polyvinyl alcohol or a polysaccharide. ### Claim 14 (depends on 10) A water-resistant gas-barrier film according to claim 10, which further contains a cross-linking agent for the hydrogen-bonding group of the hydrogen-bonding resin. ### Claim 15 (depends on 14) A water-resistant gas-barrier film according to claim 14, wherein the cross-linking agent is a compound containing zirconium. ### Claim 16 (depends on 10) A water-resistant gas-barrier film according to claim 10, wherein the film has an oxygen permeability per .mu.m of thickness at 31.degree. C. and 61% RH of 2 cc/m.sup.2 /day/atm or less. ### Claim 17 (depends on 10) A water-resistant gas-barrier film according to claim 10, wherein the film has an oxygen permeability per .mu.m of thickness at 31.degree. C. and 61% RH of 0.2 cc/m.sup.2 /day/atm or less. ### Claim 18 (depends on 10) A water-resistant gas-barrier film according to claim 10, wherein the clay mineral is selected from the group consisting of montmorillonite, hectorite, sodium terasililic mica, sodium taeniolite, and any combination thereof.