# US 5,700,398 A · Composition containing a polymer and conductive filler and use thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,700,398 A - Document ID: US5700398A - Status: Granted - Kind: A - Application number: 08/356,026 - Filed: 1994-12-14 - Granted: 1997-12-23 - Earliest claimed: 1994-12-14 - Assignees: International Business Machines Corporation - Inventors: Marie Angelopoulos; Vlasta A. Brusic; Teresita Ordonez Graham; Sampath Purushothaman; Ravi F. Saraf; Jane Margaret Shaw; Judith Marie Roldan; Alfred Viehbeck - Web page: https://patentgrep.com/patent/US5700398A ## CPC - H05K 9/0083: {comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers (H05K9/0086 takes precedence)} - C08G 61/12: Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule - C08L 65/00: Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C08L7/00 - C08L57/00, C08L61/00 take precedence); Compositions of derivatives of such polymers - C09D 5/08: Anti-corrosive paints - C09D 5/24: Electrically-conducting paints {(conductive materials H01B1/00)} - C09J 9/02: Electrically-conducting adhesives - H01B 1/125: {comprising aliphatic main chains, e.g. polyactylenes} - H01B 1/127: {comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes} - H01B 1/128: {comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes} - H01B 1/22: the conductive material comprising metals or alloys - H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon - H05K 3/321: by conductive adhesives - H05K 9/0079: {Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges} - H05K 9/0088: {comprising a plurality of shielding layers; combining different shielding material structure} - C08L 33/00: Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers - H05K 2201/0329: Intrinsically conductive polymer [ICP]; Semiconductive polymer - Y10S 428/901: Printed circuit - Y10T 428/24917: including metal layer - Y10T 428/25: Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles - Y10T 428/31529: Next to metal - Y10T 428/31533: Of polythioether - Y10T 428/31605: Next to free metal - Y10T 428/31663: As siloxane, silicone or silane - Y10T 428/31678: Of metal - Y10T 428/31681: Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.] - Y10T 428/31692: Next to addition polymer from unsaturated monomers - Y10T 428/31721: Of polyimide - Y10T 428/31725: Of polyamide - Y10T 428/31855: Of addition polymer from unsaturated monomers - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles. ## Claims ### Claim 1 A composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, wherein said filler component comprises electrically conductive metal particles and at least one conducting polymer selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polyanilines, substituted and unsubstituted polyazines, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted polyacetylenes, mixtures thereof, and copolymers thereof. ### Claim 2 (depends on 1) The composition of claim 1 wherein the mount of said conducting polymer is about 0.3 to about 90% by weight of the total of said polymeric matrix. ### Claim 3 (depends on 2) The composition of claim 2 wherein the amount of conductive particles is about 40 to about 95% by weight based upon the total of said conducting polymer and said polymeric matrix. ### Claim 4 (depends on 1) The composition of claim 1 wherein said polymeric matrix comprises at least one polymer selected from the group consisting of polyepoxides, polyacrylates, polysiloxanes and polyimides, polymethacrylates, polyurethanes, polyolefins, and polyamides. ### Claim 5 (depends on 1) The composition of claim 1 wherein said particles are silver or copper. ### Claim 6 (depends on 1) The composition of claim 1 wherein said metal particles are precoated with said conducting polymer. ### Claim 7 (depends on 1) The composition of claim 1 wherein said polymer is a polyaniline. ### Claim 8 (depends on 7) The composition of claim 7 wherein said polyaniline is an alkoxy substituted polyaniline. ### Claim 9 (depends on 1) The composition of claim 1 wherein said conducting polymer is unsubstituted. ### Claim 10 (depends on 1) The composition of claim 1 wherein said conducting polymer is substituted with at least one member selected from the group consisting of alkyl, aryl, alkoxy, aryloxy, alkaryl, aralkyl, Si and Ge. ### Claim 11 (depends on 10) The composition of claim 10 wherein said member contains 1-12 carbon atoms. ### Claim 12 (depends on 1) The composition of claim 1 being in the form of a paste. ### Claim 13 (depends on 1) The composition of claim 1 wherein said conducting polymer has conductivity of about 10.sup.-10 ohm.sup.-1 cm.sup.-1 to about 10.sup.6 ohm.sup.-1 cm.sup.-1.