# US 5,700,338 A · Method of manufacturing resistor integrated in sintered body and method of manufacturing multilayer ceramic electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,700,338 A - Document ID: US5700338A - Status: Granted - Kind: A - Application number: 08/490,089 - Filed: 1995-06-13 - Granted: 1997-12-23 - Earliest claimed: 1994-06-14 - Assignees: Murata Manufacturing Co., Ltd. - Inventors: Noriyuki Kubodera; Yoshiaki Kouno - Web page: https://patentgrep.com/patent/US5700338A ## CPC - H01C 17/075: by thin-film techniques - Y10T 29/49163: with sintering of base - H01C: RESISTORS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method of manufacturing a resistor integrated in a sintered body, by patterning a plurality of metal thin films which are formed by a thin film forming method, thereafter transferring the patterned metal thin films onto a ceramic green sheet (11), stacking another ceramic green sheet and/or a ceramic green sheet stacked with another metal thin film thereon for obtaining a laminate, and firing the resulting laminate, thereby forming a resistor integrated in a sintered body which is structured by by alloying the plurality of metal thin films in a ceramic sintered body. ## Claims ### Claim 1 A method of manufacturing a resistor integrated in a sintered body, comprising the steps of: preparing a metal thin film transfer material having a carrier substrate and a plurality of metal thin films formed on said carrier substrate to be in a prescribed pattern; obtaining a laminate of said metal thin films obtained from said metal thin film transfer material and ceramic green sheets; and firing said laminate for obtaining a sintered body and forming a resistor consisting of said metal thin films in said sintered body, wherein said plurality of metal thin films are alloyed during the firing of said laminate, for forming said resistor. ### Claim 2 (depends on 1) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 1, wherein said step of obtaining said laminate comprises the steps of: transferring said metal thin films from said carrier substrate to one major surface of one of said ceramic green sheets for obtaining a green sheet integrated with said metal thin films, and stacking at least one of another ceramic green sheet and another green sheet integrated with a metal thin film on said green sheet integrated with said metal thin films for obtaining said laminate. ### Claim 3 (depends on 2) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 2, wherein a plurality of said metal thin film transfer materials are prepared for transferring a plurality of said metal thin films from said plurality of metal thin film transfer materials to said one major surface of said ceramic green sheet. ### Claim 4 (depends on 3) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 3, wherein said metal thin films being provided on said plurality of metal thin film transfer materials have different patterns. ### Claim 5 (depends on 1) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 1, wherein said step of obtaining said laminate comprises the steps of: applying a slurry onto said metal thin film transfer material being provided with said metal thin films for obtaining a green sheet integrated with said metal thin films, and stacking said green sheet integrated with said metal thin films on at least one of another ceramic green sheet and another green sheet integrated with a metal thin film for obtaining a laminate. ### Claim 6 (depends on 1) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 1, wherein said step of preparing said metal thin film transfer material comprises the steps of: forming said metal thin films on said carrier substrate by a thin film forming method, and patterning said metal thin films by photolithography. ### Claim 7 (depends on 1) A method of manufacturing a multilayer ceramic electronic component, comprising the steps of the method of manufacturing a resistor integrated in a sintered body in accordance with claim 1. ### Claim 8 A method of manufacturing a resistor integrated in a sintered body, comprising the steps of: preparing a metal thin film transfer material having a carrier substrate and a plurality of metal thin films formed on said carrier substrate to be in a prescribed pattern; obtaining a laminate of said metal thin films obtained from said metal thin film transfer material, ceramic green sheets and a conductive pattern; and firing said laminate for obtaining a sintered body and forming a circuit containing a resistor consisting of said metal thin films and the conductive pattern in said sintered body wherein said plurality of metal thin films are alloyed during firing of said laminate, for forming said resistor. ### Claim 9 (depends on 8) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 8, wherein said conductive pattern is prepared by forming the conductive pattern on one of said ceramic green sheets. ### Claim 10 (depends on 9) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 9, wherein said conductive pattern is formed on the one of said ceramic green sheets by transferring it from another carrier substrate. ### Claim 11 (depends on 8) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 8, wherein said step of obtaining said laminate comprises the steps of: transferring said metal thin films from said carrier substrate to one major surface of one of said ceramic green sheets for obtaining a green sheet integrated with said metal thin films, and stacking at least one of another ceramic green sheet and another green sheet integrated with a metal thin film on said green sheet integrated with said metal thin films for obtaining said laminate. ### Claim 12 (depends on 8) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 8, wherein said step of obtaining said laminate comprises the steps of: applying a slurry onto said metal thin film transfer material being provided with said metal thin films for obtaining a green sheet integrated with said metal thin films, and stacking said green sheet integrated with said metal thin films on at least one of another ceramic green sheet and another green sheet integrated with a metal thin film for obtaining a laminate. ### Claim 13 (depends on 1) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 1, wherein said step of preparing said metal thin film transfer material comprises the steps of: forming said metal thin films on said carrier substrate by a thin film forming method, and patterning said metal thin films by photolithography. ### Claim 14 (depends on 13) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 13, wherein a plurality of said metal thin transfer materials are prepared for transferring a plurality of said metal thin films from said plurality of metal thin film transfer materials to said one major surface of one of said ceramic green sheets. ### Claim 15 (depends on 14) The method of manufacturing a resistor integrated in a sintered body in accordance with claim 14, wherein said metal thin films being provided of said plurality of metal thin film transfer materials have different patterns. ### Claim 16 (depends on 8) A method of manufacturing a multilayer ceramic electronic component, comprising the steps of the method of manufacturing a resistor integrated in a sintered body in accordance with claim 8.