# US 5,699,955 A · Method of bonding Ti-alloy members > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,699,955 A - Document ID: US5699955A - Status: Granted - Kind: A - Application number: 08/646,483 - Filed: 1996-05-08 - Granted: 1997-12-23 - Earliest claimed: 1995-08-30 - Assignees: Daido Steel Co., Ltd. - Inventors: Takao Shimizu; Hirotsugu Horio - Web page: https://patentgrep.com/patent/US5699955A ## CPC - B23K 20/16: with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas - B23K 35/005: {at least one of the workpieces being of a refractory metal} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract A method of firmly jointing Ti-alloy members of various shapes such as pipes and rods by solid diffusion bonding. The members are butted and heated under pressure in a non-oxidizing atmosphere, while a Ti-layer is disposed at the interface of butting by either (1) inserting a sheet for bonding made of Ti having a thickness of 500 .mu.m or less between the butted faces, or (2) previously forming a Ti-layer for bonding having a thickness of 1 .mu.m or more on at least one of the butted faces by any method such as vapor deposition. ## Claims ### Claim 1 A method of bonding Ti-alloy members comprising: butting two Ti-alloy members to be bonded with insertion of a Ti-sheet of thickness 500 .mu.m or less between the butted faces of the members; heating the butted faces to a high temperature near but lower than the transformation temperature of the Ti-alloy, in a non-oxidizing atmosphere, while applying pressure of 5 MPa or higher to the butted faces; and holding the members for a period of 3 minutes or longer. ### Claim 2 A method of bonding Ti-alloy members comprising: forming a Ti layer of a thickness of 1 .mu.m or more at least one of the two ends of the two Ti-alloy members to be bonded; butting the faces of the two members; heating the butted faces to a high temperature near but lower than the transformation temperature of the Ti-alloy, in a non-oxidizing atmosphere, while applying pressure of 5 MPa or higher to the butted faces; and holding the members for a period of 3 minutes or longer. ### Claim 3 A method of bonding Ti-alloy members comprising: butting two Ti-alloy members to be bonded with insertion of an intermediate member having Ti-layers of a thickness of 1 .mu.m or more between the butted faces of the two members to be bonded; heating the butted faces to a high temperature near but lower than the transformation temperature of the Ti-alloy, in a non-oxidizing atmosphere, while applying pressure of 5 MPa or higher to the butted faces; and holding the members for a period of 3 minutes or longer. ### Claim 4 (depends on 1) A method of bonding Ti-alloy members according to claim 1 wherein the Ti-alloy contains an additive element or elements of group I below or additive elements of groups I and II below and the balance being substantially Ti: I) 30% or less of one or more of Al up to 10%, V up to 25%, Sn up to 15%, Co up to 10%, Cu up to 10%, Ta up to 15%, Mn up to 10%, Hf up to 10%, W up to 10%, Si up to 0.5%, Nb up to 20%, Zr up to 10%, Mo up to 15% and O up to 0.1% (in case of two or more are added, in total); and II) a combination of 10% or less of one or more (in case of two or more are used, in total) of S 0.1-10%, Se 0.01-10% and Te 0.01-10%; and one or two of REM 0.01-10% and Ca 0.01-10% (in case of two are used, up to 10% in total). ### Claim 5 (depends on 1) A method of bonding Ti-alloy members according to claim 1 wherein the non-oxidizing atmosphere is an inert gas atmosphere in which O.sub.2 and N.sub.2 contents being both up to 0.01 vol. % at a normal or around normal pressure, or a vacuum under a pressure of 10.sup.-4 Torr or lower. ### Claim 6 (depends on 1) A method of bonding Ti-alloy members according to claim 1, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 7 (depends on 6) A method of bonding Ti-alloy members according to claim 6, wherein the high-frequency induction heating is carried out under maintaining temperature of the ends to be heated by measuring the temperature of the heated ends and controlling imposed high-frequency electric power on the basis of the measured temperature. ### Claim 8 (depends on 2) A method of bonding Ti-alloy members according to claim 2, wherein the Ti-alloy contains an additive element or elements of group I below or additive elements of groups I and II below and the balance being substantially Ti: I) 30% or less of one or more of Al up to 10%, V up to 25%, Sn up to 15%, Co up to 10%, Cu up to 10%, Ta up to 15%, Mn up to 10%, Hf up to 10%, W up to 10%, Si up to 0.5%, Nb up to 20%, Zr up to 10%, Mo up to 15% and O up to 0.1% (in case of two or more are added, in total); and II) a combination of 10% or less of one or more (in case of two or more are used, in total) of S 0.1-10%, Se 0.01-10% and Te 0.01-10%; and one or two of REM 0.01-10% and Ca 0.01-10% (in case of two are used, up to 10% in total). ### Claim 9 (depends on 3) A method of bonding Ti-alloy members according to claim 3, wherein the Ti-alloy contains an additive element or elements of group I below or additive elements of groups I and II below and the balance being substantially Ti: I) 30% or less of one or more of Al up to 10%, V up to 25%, Sn up to 15%, Co up to 10%, Cu up to 10%, Ta up to 15%, Mn up to 10%, Hf up to 10%, W up to 10%, Si up to 0.5%, Nb up to 20%, Zr up to 10%, Mo up to 15% and O up to 0.1% (in case of two or more are added, in total); and II) a combination of 10% or less of one or more (in case of two or more are used, in total) of S 0.1-10%, Se 0.01-10% and Te 0.01-10%; and one or two of REM 0.01-10% and Ca 0.01-10% (in case of two are used, up to 10% in total). ### Claim 10 (depends on 2) A method of bonding Ti-alloy members according to claim 2, wherein the non-oxidizing atmosphere is an inert gas atmosphere in which O.sub.2 and N.sub.2 contents being both up to 0.01 vol. % at a normal or around normal pressure, or a vacuum under a pressure of 10.sup.-4 Torr or lower. ### Claim 11 (depends on 3) A method of bonding Ti-alloy members according to claim 3, wherein the non-oxidizing atmosphere is an inert gas atmosphere in which O.sub.2 and N.sub.2 contents being both up to 0.01 vol. % at a normal or around normal pressure, or a vacuum under a pressure of 10.sup.-4 Torr or lower. ### Claim 12 (depends on 4) A method of bonding Ti-alloy members according to claim 4, wherein the non-oxidizing atmosphere is an inert gas atmosphere in which O.sub.2 and N.sub.2 contents being both up to 0.01 vol. % at a normal or around normal pressure, or a vacuum under a pressure of 10.sup.-4 Torr or lower. ### Claim 13 (depends on 8) A method of bonding Ti-alloy members according to claim 8, wherein the non-oxidizing atmosphere is an inert gas atmosphere in which O.sub.2 and N.sub.2 contents being both up to 0.01 vol. % at a normal or around normal pressure, or a vacuum under a pressure of 10.sup.-4 Torr or lower. ### Claim 14 (depends on 9) A method of bonding Ti-alloy members according to claim 9, wherein the non-oxidizing atmosphere is an inert gas atmosphere in which O.sub.2 and N.sub.2 contents being both up to 0.01 vol. % at a normal or around normal pressure, or a vacuum under a pressure of 10.sup.-4 Torr or lower. ### Claim 15 (depends on 2) A method of bonding Ti-alloy members according to claim 2, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 16 (depends on 3) A method of bonding Ti-alloy members according to claim 3, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 17 (depends on 4) A method of bonding Ti-alloy members according to claim 4, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 18 (depends on 5) A method of bonding Ti-alloy members according to claim 5, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 19 (depends on 8) A method of bonding Ti-alloy members according to claim 8, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 20 (depends on 9) A method of bonding Ti-alloy members according to claim 9, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 21 (depends on 10) A method of bonding Ti-alloy members according to claim 10, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 22 (depends on 11) A method of bonding Ti-alloy members according to claim 11, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 23 (depends on 12) A method of bonding Ti-alloy members according to claim 12, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 24 (depends on 13) A method of bonding Ti-alloy members according to claim 13, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less. ### Claim 25 (depends on 14) A method of bonding Ti-alloy members according to claim 14, wherein heating is carried out by high-frequency induction heating with a high-frequency electric power of 200 kHz or less.