# US 5,699,953 A · Multi resonance unibody ultrasonic transducer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,699,953 A - Document ID: US5699953A - Status: Granted - Kind: A - Application number: 08/654,256 - Filed: 1996-05-28 - Granted: 1997-12-23 - Earliest claimed: 1994-12-05 - Assignees: Kulicke & Soffa Investments, Inc. - Inventors: Ali Reza Safabakhsh - Web page: https://patentgrep.com/patent/US5699953A ## CPC - B23K 20/106: {Features related to sonotrodes} - B06B 1/0614: {for generating several frequencies} - B06B 3/00: Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency - H10W 72/0711: {Apparatus therefor} - H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5524: {comprising aluminium [Al]} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A multi-resonance frequency ultrasonic transducer has a plurality of useful resonance frequencies for wire bonding operation and comprises an integral unibody with a rectangular aperture in the center of its mass. A multi-frequency stack of transducer drivers is mounted in the rectangular aperture with compression wedges. The length L of the stack of transducer drivers is equal to or less than one-quarter of one wavelength of the lower useful resonance frequency and the design envelopes for the useful frequencies embrace two or more useful fixed frequencies separated from spurious unusable frequencies by a minimum of two kilohertz. ## Claims ### Claim 1 The method of making fine wire interconnections, comprising the steps of: providing a multi-frequency ultrasonic transducer of the type having a plurality of resonance frequencies, providing a multi-frequency ultrasonic generator coupled to said ultrasonic transducer, and providing a controller for selecting one or more of the plurality of resonance frequencies produced by ultrasonic generator, and coupling different ones of said plurality of resonance frequencies to said multi-frequency ultrasonic transducer during a wire bonding operation. ### Claim 2 (depends on 1) The method as set forth in claim 1 wherein the step of coupling different ones of said resonance frequencies to said multi-frequency ultrasonic transducer comprises the step of coupling different frequencies to said transducer during different bonding operations. ### Claim 3 (depends on 1) The method as set forth in claim 1 wherein the step of coupling different ones of said resonance frequencies to said multi-frequency transducer comprises the steps of coupling a plurality of different frequencies to said multi frequency transducer during the same bonding operation. ### Claim 4 The method of making fine wire interconnections using an automatic wire bonder of the type employing a bonding tool mounted in an ultrasonic transducer, comprising the steps of: coupling a multi-frequency ultrasonic generator to said ultrasonic transducer, applying a bonding force through said bonding tool to a fine wire to be bonded to a target, coupling a plurality of resonance frequency outputs from said multi-frequency ultrasonic generator to said ultrasonic transducer during a wire bonding operation, and applying a plurality of different frequencies to said ultrasonic transducer while engaging said fine wire against said target. ### Claim 5 (depends on 4) The method as set forth in claim 4 wherein the step of applying a plurality of frequencies to said ultrasonic transducer comprises the steps of: applying at least two different frequencies simultaneously while making a fine wire bond. ### Claim 6 (depends on 4) The method as set forth in claim 4 wherein the step of applying a plurality of different frequencies to said ultrasonic transducer comprises applying different frequencies at a first and a second wire bond. ### Claim 7 (depends on 6) The method as set forth in claim 6 wherein the step of applying a plurality of frequencies to said ultrasonic transducer comprises applying a plurality of different frequencies to said ultrasonic transducer at said first and said second wire bond. ### Claim 8 (depends on 4) The method as set forth in claim 4 wherein said plurality of frequencies being generated by said multi-frequency ultrasonic generator comprises at least two frequencies which are distinct transducer resonance frequencies of said ultrasonic transducer. ### Claim 9 (depends on 4) The method as set forth in claim 4 wherein said plurality of frequencies being generated by said multi-frequency ultrasonic generator comprise frequencies which include non-harmonic frequencies of a lower frequency. ### Claim 10 (depends on 4) The method as set forth in claim 4 wherein some of said plurality of frequencies are applied simultaneously during a bonding operation. ### Claim 11 (depends on 6) The method as set forth in claim 6 wherein the step of applying a plurality of different frequencies to said ultrasonic transducer comprises applying generated frequencies at said first and second wire bonds in excess of two frequencies. ### Claim 12 The method of making fine wire bonds on semiconductor devices to optimize the strength of the first and second wire bonds comprising the steps of: making a plurality of first and second wire bonds at different frequencies, selecting the frequencies used at first and second wire bonds which result in the strongest wire bonds, programming the selected frequencies for first wire bonds into a wire bonding machine, programming the selected frequencies for second wire bonds into the wire bonding machine, and automatically making fine wire interconnection at first and second wire bond at the selected frequencies while coupling the selected frequencies to a multi-frequency responsive transducer.