# US 5,699,611 A · Method of hermetically self-sealing a flip chip

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- Number: US 5,699,611 A
- Document ID: US5699611A
- Status: Granted
- Kind: A
- Application number: 08/699,886
- Filed: 1995-08-16
- Granted: 1997-12-23
- Earliest claimed: 1994-06-14
- Assignees: Hughes Electronics Corporation
- Inventors: Garrett Isao Kurogi; Matthew J. Swass
- Web page: https://patentgrep.com/patent/US5699611A

## CPC

- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H10W 76/60: Seals
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H05K 2203/1147: Sealing or impregnating, e.g. of pores
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/49126: Assembling bases
- Y10T 29/49144: by metal fusion
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A package containing an integrated circuit has all of its I/O contacts on one of the package faces. The periphery of that face is processed to be wettable with solder. The substrate to which the package is to be attached has corresponding contacts and has a solder wettable ring comparable to the ring at the periphery at the package face. When the package is positioned on the substrate it is hermetically sealed therearound by soldering the two rings together, such as by reflow soldering.

## Claims

### Claim 1

The method of hermetically sealing an integrated circuit-containing body to a substrate comprising the steps of:
forming the body so that one face thereof has I/O contacts thereon, so that said contacts correspond in position to said contacts on said substrates;
forming a barrier having a contact thereon on the face of the body adjacent the periphery of the body and positioned to surround the contacts;
forming corresponding contacts on the face of a substrate positioned so that when the body lines face-to-face on the substrate, the contacts are against each other;
forming a barrier, having a contact thereon, on the substrate surrounding the contacts on the substrate and positioned to lie against the barrier on the body when the contacts are in face-to-face contact;
attaching the body to the substrate at the barrier to create a hermetic seal around the contacts;
forming at least one printed wiring strip on the surface of said dielectric substrate;
forming an insulator layer over said printed wiring strip;
positioning said surrounding barrier on said substrate over said insulating layer so that said surrounding barrier is electrically isolated from said printed wiring strip; and
wherein the steps of forming a barrier on the face of the body and forming a barrier on the substrate includes the positioning of solder so that attachment and sealing is by means of reflow soldering and when the sealing is complete a fillet of solder is visible around the body at the substrate.