# US 5,699,597 A · Method of manufacturing a tantalum solid state electrolytic capacitor

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,699,597 A
- Document ID: US5699597A
- Status: Granted
- Kind: A
- Application number: 08/452,433
- Filed: 1995-05-26
- Granted: 1997-12-23
- Earliest claimed: 1994-05-30
- Assignees: Rohm Co., Ltd.
- Inventors: Shinji Nakamura; Chojiro Kuriyama
- Web page: https://patentgrep.com/patent/US5699597A

## CPC

- H01G 9/15: Solid electrolytic capacitors (H01G11/00 takes precedence)
- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/236: leading through the housing, i.e. lead-through
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

The use of a wire of a metal other than tantalum as a lead wire fixed to a chip formed by sintering tantalum powder is enabled. Prior to the formation of a dielectric film on a chip through anodic oxidation, an insulating material is applied to a surface of the lead wire fixed to the chip at a connection with the chip. With the application of the insulating material, a short circuit between the lead wire and a chemical conversion solution is prevented when the entire chip is drenched in the chemical conversion solution in anodic oxidation, so that a dielectric film of tantalum pentoxide is surely formed on the chip. As the lead wire, an arbitrary metal having conductivity may be used.

## Claims

### Claim 1

A capacitor device manufacturing method comprising the steps of:
preparing a tantalum sintered body having a copper or aluminum lead wire on one end surface thereof;
applying an insulating material to a surface of a root portion of the lead wire adjacent to the tantalum sintered body;
drenching the tantalum sintered body and a part of the root portion of the lead wire, to which the insulating material is applied, in a chemical conversion solution;
causing anodic oxidation by applying a current between the lead wire and the chemical conversion solution to form a dielectric film on a surface of the tantalum sintered body;
forming a solid state electrolytic layer on a surface of the dielectric film; and
forming a cathode electrode film on a surface of the solid state electrolytic layer.

### Claim 2 (depends on 1)

A capacitor device manufacturing method according to claim 1,
wherein said tantalum sintered body having the lead wire on one end surface thereof is prepared by hardening and shaping tantalum powder into a porous chip;
sintered the porous chip to convert it into a sintered body; and
fixing the lead wire to one end surface of the sintered body.

### Claim 3 (depends on 1)

A capacitor device manufacturing method according to claim 1,
wherein said tantalum sintered body having the lead wire on one end surface thereof is prepared by hardening and shaping tantalum powder with a part of the lead wire imbedded therein into a porous chip having the lead wire on one end surface thereof; and
sintering the porous chip to convert it into a sintered body.

### Claim 4 (depends on 1)

A capacitor device manufacturing method according to claim 1, wherein said lead wire is fixed to one end surface of the tantalum sintered body, and wherein the insulating material is continuously formed between the one end surface of the tantalum sintered body and the surface of the lead wire.

### Claim 5 (depends on 4)

A capacitor device manufacturing method according to claim 4, wherein the insulating material is applied to the end surface of the tantalum sintered body so as to infiltrate into the tantalum sintered body, and after the solid state electrolytic layer is formed, the lead wire is cut at the connection with the tantalum sintered body.

### Claim 6 (depends on 5)

A capacitor device manufacturing method according to claim 5, wherein an anode electrode film is formed at the end surface of the tantalum sintered body after the lead wire is cut.