Epoxy resin compositions for encapsulating signal transmission devices
AssigneeUniroyal Chemical Company, Inc.
InventorsWilliam Davis Sigworth, Thomas Harald Peter
Life of this patent
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Abstract
A room-temperature curable composition useful for encapsulating transmission signal devices, comprising: (1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more; (2) an epoxy-functional compound having an epoxy functionality of 2 or more; and (3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds. The composition is useful for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks.
Claims9
A room-temperature curable composition comprising:
- (1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2.3 or more;
- (2) a 1,2-epoxy-functional compound having a molecular weight of 1000 or higher, and an epoxy functionality of 4.4;
- and
- (3) a curative catalyst comprising a Lewis acid, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds,
- wherein the mount of the 1,2-epoxy-functional compound is about 17% to 50%, by weight, of the mixture of the 1,2-epoxy-functional compound and the hydroxy-functional compound.
A room-temperature curable composition comprising:
- (1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2.3 or more;
- (2) a 1,2-epoxy-functional compound having an epoxy functionality of 2 or more;
- (3) a curative catalyst composition which comprises:
- (1) a catalytically effective amount of a Lewis acid;
- and
- (2) a titanate having the structure
- Ti(OR.sup.1)(OR.sup.2)(OR.sup.3)(OR.sup.4)
- wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently alkyl or aryl, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds,
- wherein the amount of the 1,2-epoxy-functional compound is about 10% to 50%, by weight, of the mixture of the 1,2-epoxy-functional compound and the hydroxy-functional compound.
Dependencies are inferred from the claim text.