Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
AssigneeMicron Technology, Inc.
InventorJames M. Wark
Life of this patent
Estimating the term…
Abstract
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and then wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner.
Claims32
A method of assembling a multi-chip structure on a base having a surface for carrying the structure, the method comprising:
- providing a plurality of flip-chip pads arranged in a pattern on the surface of the base defining an area thereon;
- providing a plurality of wire-bondable pads arranged in a pattern on the surface of the base and at least partially bounding the area defined by the pattern of flip-chip pads;
- interconnecting the wire-bondable pads and the flip-chip pads so the wire-bondable pads as a group electrically mirror the flip-chip pads as a group;
- positioning a first integrated circuit chip so a front-side surface thereof faces the surface of the first chip of the base with a plurality of flip-chip bumps on the front-side surface aligned with the flip-chip pads on the surface of the base;
- connecting the flip-chip bumps on the front-side surface of the first chip to the flip-chip pads on the surface of the base;
- positioning a second integrated circuit chip so a back-side surface thereof faces a back-side surface of the first chip;
- attaching the back-side surface of the second chip to the back-side surface of the first chip;
- and
- connecting a plurality of bond pads on a front-side surface of the second chip to the wire-bondable pads on the surface of the base.
A method of repairing an integrated circuit die flip-chip bonded to a surface of a die-carrying base, the flip-chip bonded die having opposing front and back-side surfaces, the front-side surface having flip-chip bumps thereon bonded to flip-chip pads on the surface of the base, the flip-chip pads being connected to conductors for communication between the flip-chip bonded die and circuitry external to the die, the method comprising:
- providing a plurality of wire-bondable pads on the surface of the base arranged generally about the perimeter of the flip-chip bonded die and each connected to one of the conductors;
- back-bonding a replacement integrated circuit die having opposing front and back-side surfaces to the back-side surface of the flip-chip bonded die;
- interrupting communication between the flip-chip bonded die and external circuitry;
- and
- wire-bonding bond pads on the front-side surface of the replacement die to the wire-bondable pads on the surface of the base for communication between the replacement die and external circuitry.
A method of making a base for carrying integrated circuit dice, the method comprising:
- providing a plurality of flip-chip pads on a surface of the base and arranging the pads in a pattern on the surface so the pads are flip-chip bondable to flip-chip bumps on a first integrated circuit die carryable on the surface of the base;
- providing a plurality of wire-bondable pads on the surface of the base and arranging the pads generally about a perimeter of an area on the surface of the base defined by the pattern of flip-chip pads so the flip-chip pads are wire-bondable to bond pads on a second integrated circuit die carryable on the first integrated circuit die;
- and
- interconnecting the wire-bondable pads and the flip-chip pads so the wire-bondable pads as a group electrically mirror the flip-chip pads as a group.
A method of assembling a multi-chip structure on a base having a surface for carrying the structure, the method comprising:
- forming a plurality of flip-chip pads arranged in a pattern on the surface of the base defining an area thereon;
- forming a plurality of wire-bondable pads arranged in a pattern on the surface of the base and at least partially bounding the area defined by the pattern of flip-chip pads;
- interconnecting the wire-bondable pads and the flip-chip pads so the wire-bondable pads as a group electrically mirror the flip-chip pads as a group;
- positioning a first integrated circuit chip so a front-side surface thereof faces the surface of the base with a plurality of flip-chip bumps on the front-side surface aligned with the flip-chip pads on the surface of the base;
- connecting the flip-chip bumps on the front-side surface of the first chip to the flip-chip pads on the surface of the base;
- positioning a second integrated circuit chip so a back-side surface thereof faces a back-side surface of the first chip;
- attaching the back-side surface of the second chip to the back-side surface of the first chip;
- and
- connecting a plurality of bond pads on a front-side surface of the second chip to the wire-bondable pads on the surface of the base.
A method of repairing an integrated circuit die flip-chip bonded to a surface of a die-carrying base, the flip-chip bonded die having opposing front and back-side surfaces, the front-side surface having flip-chip bumps thereon bonded to flip-chip pads on the surface of the base, the flip-chip pads being connected to conductors for communication between the flip-chip bonded die and circuitry external to the die, the method comprising:
- forming a plurality of wire-bondable pads on the surface of the base arranged generally about the perimeter of the flip-chip bonded die and each connected to one of the conductors;
- back-bonding a replacement integrated circuit die having opposing front and back-side surfaces to the back-side surface of the flip-chip bonded die;
- interrupting communication between the flip-chip bonded die and external circuitry;
- and
- wire-bonding bond pads on the front-side surface of the replacement die to the wire-bondable pads on the surface of the base for communication between the replacement die and external circuitry.
A method of making a base for carrying integrated circuit dice, the method comprising:
- forming a plurality of flip-chip pads on a surface of the base and arranging the pads in a pattern on the surface so the pads are flip-chip bondable to flip-chip bumps on a first integrated circuit die carryable on the surface;
- forming a plurality of wire-bondable pads on the surface of the base and arranging the pads generally about a perimeter of an area on the surface defined by the pattern of flip-chip pads so the pads are wire-bondable to bond pads on a second integrated circuit die carryable on the first integrated circuit die;
- and
- interconnecting the wire-bondable pads and the flip-chip pads so the wire-bondable pads as a group electrically mirror the flip-chip pads as a group.
Dependencies are inferred from the claim text.