US 5,694,344 A · Method for electrically modeling a semiconductor package

Abstract

A method of electrically modeling a semiconductor package is provided. The method reduces computation time for mutual inductance calculations between interconnect lines of the semiconductor package. Only interconnect within a predetermined distance of an interconnect line being modeled is calculated for mutual inductance. The predetermined distance is selected such that any interconnect line greater than the predetermined distance away from the interconnect line being modeled produces a negligible or small mutual inductance. This greatly reduces the number of calculations for semiconductor packages having a large number of interconnect lines. Each interconnect line modeled is broken into segments for calculating mutual inductance. An algorithm is used that calculates the mutual inductance between a pair of arbitrarily oriented straight line metal segments. The algorithm requires a single integration which significantly reduces computation time when compared with systems solving Maxwell's equation in three dimensions.

Claims12

Dependent claims

A method for generating an electrical model of semiconductor package comprising the steps of:

providing a physical description of the semiconductor package;
selecting an interconnect line of the semiconductor package to be modeled;
identifying interconnect lines of the semiconductor package within a predetermined distance from said selected interconnect line;
modeling a resistance, capacitance, and a self inductance of said selected interconnect line;
and
calculating mutual inductance between said selected interconnect and said interconnect within said predetermined distance of said selected interconnect line wherein interconnect lines of the semiconductor package more than said predetermined distance away from said selected interconnect line are not calculated for mutual inductance with said selected interconnect line.

3 more elements

A method for electrically modeling a semiconductor package comprising the steps of:

providing a physical description of the semiconductor package;
calculating mutual inductance between interconnect lines within a predetermined distance from one another, interconnect lines of the semiconductor package greater than said predetermined distance are not calculated for mutual inductance thereby reducing computation time;
and
calculating mutual inductance between straight line segments of interconnect lines of the semiconductor package wherein an algorithm that requires a single integration is used for calculating mutual inductance between a pair of arbitrarily oriented straight line segments and wherein an orientation between segments is determined from said description of said physical layout of the semiconductor package.

1 more element

Dependencies are inferred from the claim text.

Method for electrically modeling a semiconductor package

Life of this patent

Method for electrically modeling a semiconductor package

Life of this patent

Abstract

Claims12