US 5,693,111 AGranted

Method for sealedly forming envelope

AssigneeFutaba Denshi Kogyo K.K.

InventorsAkira Kadowaki, Shigeo Itoh, Youich Kogure, Takeshi Tonegawa

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Abstract

A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.

Claims5

Dependent claims

A method for sealedly forming an envelope, the method comprising the steps of:

applying a sealing glass material to a periphery of at least one of a first substrate made of a glass material and a second substrate made of a glass, metal or semiconductor material;
registering said first and second substrates with each other while superposing said first and second substrates on each other through said sealing glass material;
locally heating said sealing material by a local heating means after the registration between said first substrate and the second substrate to temporarily bond said first and second substrates to each other at least at two locations thereof;
and
heating said registered and temporarily bonded first and second substrates in an oven to sealedly bond said substrates to each other and sealedly form an envelope.

2 more elements

Dependencies are inferred from the claim text.