Loading patent…
AssigneeMassachusetts Institute of Technology
InventorsStephen A. Ward, Gill A. Pratt, John N. Nguyen, John S. Pezaris, Norman Margolus
Estimating the term…
Circuit supporting modules form a three-dimensional communication interconnect mesh. A first embodiment three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure. In a second embodiment the interconnect is hexahedral. A characteristic of both is embodiments is that, although connections are made to plural other modules, the physical connections are made along the same direction.
A three-dimensional electronic circuit assembly comprising:
A three-dimensional electronic circuit assembly comprising:
A method of providing a three-dimensional electronic circuit assembly, comprising:
A method of providing a three-dimensional electronic circuit assembly, comprising:
An electronic circuit assembly comprising data processing modules in a three-dimensional lattice supporting respective circuits, each module having at least six possible logical axes of connection to other modules of the lattice, wherein physical connections to the other modules are made with connectors that connect along the same direction and the lattice has the logical interconnectivity of a cubic lattice.
Dependencies are inferred from the claim text.