Semiconductor device with removably fixed lead frame
AssigneeFuji Electric Co., Ltd.
InventorsShin Soyano, Susumu Toba
Life of this patent
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Abstract
A semiconductor device of the invention is formed of an insulative case frame with a frame portion having elongated coupling holes, a radiator base plate covering a first opening of the insulative case frame, a circuit board with semiconductor chips bonded to the radiator base plate, a resin sealant filled in an inner space of the case frame for covering the circuit board, an insulative cover plate closing a second opening of the insulative case frame, and at least one lead frame having elastic coupling protrusions and inner leads. The elastic coupling protrusions are elastically retained in the elongated coupling holes to securely connect the lead frame to the case frame.
Claims5
A semiconductor device comprising:
- an insulative case frame including a frame portion having elongated coupling holes and first and second openings;
- a radiator base plate covering the first opening of the insulative case frame;
- a circuit board with semiconductor chips thereon, said circuit board being bonded to the radiator base plate;
- a resin sealant filled in an inner space of the case frame, said resin sealant covering the circuit board;
- an insulative cover plate closing the second opening of the insulative case frame;
- and
- at least one lead frame having elastic coupling protrusions and inner leads, said elastic coupling protrusions being elastically retained in the elongated coupling holes to securely connect the lead frame to the case frame, one elastic coupling protrusion and one elongated coupling hole which engage together being inclined relative to each other to have a torsion angle in a direction of inserting the coupling protrusion to the coupling hole, said elastic coupling protrusions situated adjacent to each other in the at least one lead frame being inclined in directions opposite to each other and inclined relative to the elongated holes to thereby elastically engage the coupling protrusion and the elongated hole.
A semiconductor device comprising:
- an insulative case frame including a frame portion having elongated coupling holes and first and second openings;
- a radiator base plate covering the first opening of the insulative case frame;
- a circuit board with semiconductor chips thereon, said circuit board being bonded to the radiator base plate;
- a resin sealant filled in an inner space of the case frame, said resin sealant covering the circuit board;
- an insulative cover plate closing the second opening of the insulative case frame;
- and
- at least one lead frame having elastic coupling protrusions and inner leads, said elastic coupling protrusions being elastically retained in the elongated coupling holes to securely connect the lead frame to the case frame, one elastic coupling protrusion and one elongated coupling hole which engage together being inclined relative to each other to have a torsion angle in a direction of inserting the coupling protrusion to the coupling hole, said elongated coupling holes situated adjacent to each other in the case frame and to be connected to the coupling protrusions being inclined in directions opposite to each other and inclined relative to the coupling protrusions to thereby elastically engage the coupling protrusions and the elongated holes.
Dependencies are inferred from the claim text.