Multiple intake duct microprocessor cooling system
AssigneeIntel Corporation
InventorDaryl J. Nelson
Life of this patent
Estimating the term…
Abstract
An apparatus for cooling the components within an enclosed computer system. The apparatus includes a first compartment containing a power supply and a fan, a second compartment containing a variety of electrical components and an air duct containing the computer system microprocessor. The air duct directs an air flow from the exterior of the computer system enclosure across the microprocessor to an inlet opening of the first compartment. Holes are provided within the air duct at points downstream of the microprocessor to permit an air flow from the second compartment into the air duct. The fan generates an air stream through the cooling system and exhausts to the exterior of the computer system enclosure.
Claims13
In a computer system enclosure containing a processor, a power supply and at least one electrical component, a cooling system comprising:
- an air duct containing said processor, said air duct directing a first air flow from the exterior of said enclosure over said processor to an inlet opening of a first compartment containing said power supply, said air duct further comprising a second opening downstream of said processor coupling second air flow from a second compartment containing said electrical component into said air duct;
- and
- an air moving device disposed within said first compartment, said air moving device having an air exhaust to the exterior of said enclosure.
A computer system enclosure containing an integrated circuit package, power supply and at least one electrical component, said enclosure comprising:
- a first compartment containing said power supply, said first compartment having a first and second opening;
- an air moving device disposed within said first compartment, said air moving device having an air exhaust through said second opening to the exterior of said enclosure;
- a second compartment containing said electrical component;
- and
- an air duct containing said integrated circuit package, said air duct directing a first air flow from the exterior of said enclosure to said first opening of said first compartment, said air duct further comprising a third opening coupling second air flow from said second compartment into said air duct.
In a computer system enclosure containing a processor, power supply and at least one electrical component, a cooling system comprising:
- an air duct containing said processor and directing a first air flow from the exterior of said enclosure over said processor to an inlet opening of a first compartment containing said power supply, said air duct further comprising a second opening downstream of said processor coupling second air flow from a second compartment containing said electrical component into said first compartment via said duct, and
- air moving means disposed within said first compartment for providing air movement through said cooling system, said air moving means having an air exhaust to the exterior of said enclosure.
Dependencies are inferred from the claim text.