Chip type thick film capacitor and method of making the same

A method of making a chip type thick film capacitor, comprising the steps of:

• simultaneously forming a first lead electrode and a second lead electrode on a head surface of an insulating chip, the first and second lead electrodes being spaced from each other;
• simultaneously forming a first capacitor electrode and an auxiliary electrode on the head surface of the chip, the first capacitor electrode being electrically connected to the first lead electrode, the auxiliary electrode being electrically connected to the second lead electrode but spaced from the first capacitor electrode by a predetermined distance;
• forming a dielectric layer on the first capacitor electrode;
• forming a second capacitor electrode on the dielectric layer, the second capacitor electrode being electrically connected to the auxiliary electrode.

A method of making a chip type thick film capacitor which also incorporates a thick film resistor, the method comprising the steps of:

• simultaneously forming a first lead electrode and a second lead electrode on a head surface of an insulating chip, the first and second lead electrodes being spaced from each other;
• simultaneously forming a first capacitor electrode and an auxiliary electrode on the head surface of the chip, the first capacitor electrode being spaced from both of the first and second lead electrodes, the auxiliary electrode being electrically connected to the first lead electrode but spaced from the first capacitor electrode by a predetermined distance;
• forming a resistor layer on the head surface of the chip to extend between the first capacitor electrode and the auxiliary electrode;
• forming a dielectric layer on the first capacitor electrode;
• forming a second capacitor electrode on the dielectric layer, the second capacitor electrode being electrically connected to the second lead electrode.