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US 5,691,760 AGranted
Photosensitive silicon chip having photosites spaced at varying pitches
AssigneeXerox Corporation
InventorsPaul A. Hosier, Jagdish C. Tandon
Life of this patent
Estimating the term…
Abstract
In a hard-copy scanner in which a set of photosensitive silicon chips are abutted to form a single page-width array of photosensors, the photosites at the critical ends of each chip are irregularly spaced, relative to the other photosites on the chip. This irregular spacing enables compensation for imprecisions in the dimensions of individual chips. The spacing principle can be applied as well to LED's or portions of ink-jet ejectors.
Claims15
A photosensitive device, comprising:
- a semiconductor chip;
- a plurality of regular photosites provided on a main surface of the chip, each regular photosite defining a perimeter, the regular photosites being arranged in a linear array with each regular photosite being spaced from the perimeter of a neighboring regular photosite by a predetermined first spacing distance;
- an end photosite provided at one end of the linear array, said end photosite not included in said plurality of regular photosites, the end photosite defining a perimeter;
- and
- a next-to-end photosite provided between the end photosite and a regular photosite in the linear array, said next-to-end photosite not included in mid plurally of regular photosites, the next-to-end photosite defining a perimeter,
- the perimeter of the end photosite being spaced from the perimeter of the next-to-end photosite by a predetermined second spacing distance, the second spacing distance being less than the first spacing distance.
3 more elements
A photosensitive device, comprising:
- a semiconductor chip;
- a plurality of regular photosites provided on a main surface of the chip, each regular photosite defining a perimeter, the regular photosites housing arranged in a linear array with each regular photosite being spaced from the perimeter of a neighboring regular photosite by a predetermined first spacing distance;
- an end photosite provide at one end of the linear array, said end photosite not included in said plurality of regular photosites, the end photosite defining a perimeter;
- and
- a next-to-end photosite provided between the and photosite and a regular photosite in the linear array, said next-to-end photosite not included in said plurality of regular photosites, the next-to-end photosite defining a perimeter,
- the perimeter of each regular photosite and the perimeter of the end photosite and the perimeter of the next-to-end photosite all having identical dimensions,
- the perimeter of the end photosite being spaced from the perimeter of the next-to-end photosite by a predetermined second spacing distance, the second spacing distance being less than the first spacing distance.
4 more elements
A semiconductor chip, comprising:
- a plurality of physically-identical elements defined on a main surface of the chip, each element defining a perimeter, the elements being arranged in a linear array with each element being spaced from the perimeter of a neighboring element by a predetermined first spacing distance;
- an end element disposed at one end of the linear array, said end element not included in said plurality of elements, the end element defining a perimeter;
- and
- a next-to-end structure disposed between the end element and an element in the linear array, said next-to-end element not included in said plurality of elements, the next-to-end element defining a perimeter,
- the perimeter of the end element being spaced from the perimeter of the next-to-end element by a predetermined second spacing distance, the second spacing distance being less than the first spacing distance.
2 more elements
Dependencies are inferred from the claim text.