Back to results
US 5,691,690 AGranted
Chip type jumper
AssigneeRohm Co., Ltd.
InventorsHiroaki Minato, Toshihiro Mori
Life of this patent
Estimating the term…
Abstract
A chip type jumper is provided which includes an insulating chip substrate, a single-layered conductor film formed on a surface of the chip substrate, a pair of side electrodes formed at selected edges of the chip substrate in electrical connection with the conductor film, and a protective member covering the conductor film between the pair of side electrodes.
Claims8
A chip type jumper comprising:
- an insulating chip substrate;
- a conductor film formed on a surface of said chip substrate;
- a pair of side electrodes formed at respective edges of said chip substrate in electrical connection with said conductor film;
- and
- a protective member covering said conductor film between said pair of side electrodes;
- wherein said protective member comprises a first protective layer formed directly on said conductor film, and a second protective layer formed on said first protective layer;
- and
- wherein said second protective layer has a length equal to that of said first protective layer, but a width that is narrower than that of said first protective layer.
5 more elements
A chip type jumper comprising:
- an insulated chip substrate;
- a conductor film formed on a surface of said chip substrate;
- a pair of side electrodes formed at respective edges of said chip substrate in electrical connection with said conductor film;
- and
- a protective member covering said conductor film between said pair of side electrodes;
- wherein said protective member comprises a first protective layer formed directly on said conductor film, and a second protective layer formed on said first protective layer;
- and
- wherein said first and second protective layers are each made of borosilicate flint glass.
5 more elements
Dependencies are inferred from the claim text.