Carrier having slide connectors for testing unpackaged semiconductor dice

An apparatus for testing unpackaged semiconductor dice comprising:

• a base;
• an array of external contacts formed on the base in electrical communication with a pattern of contact pads on the base;
• a first interconnect mountable to the base, said first interconnect comprising first contact members configured to electrically engage contact locations on a first die held on the base, said first interconnect further comprising a first set of contact pads in electrical communication with the first contact members;
• a second interconnect mountable to the base, said second interconnect comprising second contact members configured to electrically engage second contact locations on a second die held on the base, said second interconnect further comprising a second set of contact pads in electrical communication with the second contact members;
• a connector member attachable to the base, said connector member including a plurality of tine contacts configured to electrically contact the pattern of contact pads on the base, and to electrically contact the first set of contact pads on the first interconnect for testing the first die, or the second set of contact pads on the second interconnect for testing the second die.

An apparatus for testing unpackaged semiconductor dice comprising:

• a base;
• an array of external contacts formed on a surface of the base, said external contacts in electrical communication with a pattern of contact pads on the base;
• a first interconnect configured to mount to the base, said first interconnect comprising first contact members configured to electrically engage first contact locations on a first die retained on the base, said first contact members in electrical communication with a first pattern of contact pads on the interconnect;
• a second interconnect configured to mount to the base, said second interconnect comprising second contact members configured to electrically engage second contact locations on a second die retained on the base, said second contact members in electrical communication with a second pattern of contact pads on the interconnect;
• and
• a connector member for physically attaching the first or second interconnect to the base, said connector member comprising a molded plastic body attachable to the base, said connector member further comprising metal wires embedded within the molded plastic body, said metal wires configured to contact the pattern of contact pads on the base, and to contact the first pattern of contact pads on the first interconnect for testing the first die, or the second pattern of contact pads on the second interconnect for testing the second die.