Solvent-free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers
AssigneeShell Oil Company
InventorsKathleen Suzanne Kiibler, Jeffrey George Southwick
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AssigneeShell Oil Company
InventorsKathleen Suzanne Kiibler, Jeffrey George Southwick
Estimating the term…
The invention herein is a solvent free process for producing UV curable adhesive and sealant compositions comprising a monool, tackifying resin, and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves predispersing an insoluble photoinitiator in a component of the formulation with which it is more compatible than with the tackifying resin, and then adding the tackifying resin to the predispersion.
A solvent free process for producing a UV curable adhesive or sealant composition comprising a monohydroxylated epoxidized polydiene block polymer comprised of at least two polymerizable ethenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation, and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer, a low molecular weight polydiene monool, an insoluble photoinitiator, and a tackifying resin which is incompatible with the photoinitiator, said process comprising predispersing the photoinitiator in the monool or the polymer or a mixture of the two, and then adding the tackifying resin to the predispersion.
Dependencies are inferred from the claim text.