Phenolic resin molding material

A phenolic resin injection molding material having a melt viscosity at 100.degree. C. of 10.sup.3 Pa.s or lower, consisting essentially of

• (a) 100 parts by weight of a high ortho-novolak phenolic resin having a number-average molecular weight of 380-450 and an ortho-bond/para-bond ratio of 1.8-2.3,
• (b) 12-20 parts by weight of hexamethylenetetramine,
• (c) 0.1-10 parts by weight of a low-molecular weight polyethylene having a number average molecular weight of 300-3,000,
• (d) filler in an amount of 80-30% by weight based on the total weight of said composition,
• (e) optionally a crystalline phenolic compound having at least two benzene rings, solid at room temperature and forming a low viscosity melt at injection molding temperatures, said crystalline phenolic compound (e) when present being in an amount in a ratio with said phenolic resin of (a)/(e)=20/80 to 90/10,
• (f) optionally a compound for improving curing rate while maintaining low viscosity, said compound (f) having two or more hydroxyl groups on a benzene ring, when present being in an amount based on the total amount of (a) and (e) in the ratio ›(a)+(e)!/(f)=99/1 to 90/10, and
• (g) optionally 1-20 parts by weight of a monohydric alcohol having 5 or fewer carbon atoms and a boiling point of 80.degree.-140.degree. C.