Process for manufacturing composite semiconductor device

Abstract

A composite semiconductor device having a plurality of semiconductor chips (12, 13), a package (11) receiving the semiconductor chips (12, 13) and leads (14, 14', 15, 15') which are connected to electrode pads (17, 19) of the semiconductor chips (12, 13) and extend outside the package (11) is manufactured by a process comprising a first step for electrically connecting the electrode pads (17, 19) to the inner portion of the leads (14, 14', 15, 15') and packaging the semiconductor chips (12, 13) and the inner portion of the lead (14, 14', 15, 15') within the package (11), and a second step for connecting the lead (14') connected to the electrode pad (17) of the semiconductor chip (12) to the lead (15') connected to the electrode pad (19) of the semiconductor chip (13) by means of a solder (20) to form a composite lead (22). The second step is carried out if all of the semiconductor chips (12, 13) are proved to have a good quality in an inspection step carried out after the first step. In the inspection step, an input/output test for the outer portion of the lead (14, 14', 15, 15') extending outside the package (11) is conducted.

Dependencies are inferred from the claim text.