Heat bond seaming tape and method of manufacture

Abstract

A heat bond seaming tape has a base formed of a strip of paper or a paper-like material and an overlying strip of an open mesh material. A plurality of transversely spaced, longitudinally extending beads of a hot melt thermoplastic adhesive material is placed on a top surface of the mesh for adhering the tape to the backs of adjacent carpet edges. A strip of a rigid thermoplastic material is sandwiched between the base strip and the strip of open mesh and extends longitudinally along the center of the strip and extends transversely across the carpet seam to prevent seam buckling. The plastic strip is formed by a plurality of separate or flexibly connected hard plastic members to enable the tape to be formed into a roll for transportation and storage. The invention also relates to the method of forming the improved heat bond seaming tape.

Dependencies are inferred from the claim text.