Method and apparatus for decreasing the time needed to die bond microelectronic chips
AssigneeThe Trustees of the University of Pennsylvania
InventorKenneth John Zwick
Life of this patent
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Abstract
Disclosed is a die bonding system comprising a conveyor 10, a speaker 12 and a function generator 14. The conveyor 10 carries a leadframe 14 bearing a prescribed quantity of die bonding epoxy 16. At a station situated above the speaker 12, a chip 18 is pressed down with a force F onto the epoxy and leadframe. While this force is being applied, the function generator 14 excites the speaker 12 to generate an acoustic signal sufficient to effect the vibration of the epoxy relative to the leadframe at a frequency of about 250 Hz and an amplitude of approximately 10 to 50 .mu.m, preferably 20 .mu.m. Such a vibration causes the epoxy to flow freely to a thin, uniform thickness, and thus permits the chip to be quickly bonded to the leadframe with a small force.
Claims22
A method of bonding an integrated circuit chip to a lead frame, comprising the steps of:
- applying an adhesive to a surface of said lead frame;
- pressing the chip onto said surface on which the adhesive is applied;
- and
- inducing, with an acoustic source, vibrations of a predetermined frequency and amplitude in at least said leadframe, said amplitude being approximately 10-50 .mu.m, wherein the vibrations are induced with acoustic pressure waves that induce a vibrational force in said adhesive and chip, said force being substantially perpendicular to the chip surface in contact with said adhesive, whereby the adhesive rheology is temporarily changed in situ so that the adhesive flows to a predetermined thickness to permit the chip to be pressed to a predetermined distance from said leadframe.
A die bonding system for bonding an integrated circuit chip to a surface of a leadframe, wherein an adhesive is carried on said surface, comprising:
- means for pressing the chip onto said surface on which the adhesive is applied;
- and
- means for inducing, with an acoustic source, vibrations of a predetermined frequency and amplitude in at least said leadframe, said amplitude being approximately 10-50 .mu.m, wherein the vibrations are induced with acoustic pressure waves that induce a vibrational force in said adhesive and chip, said force being substantially perpendicular to the chip surface in contact with said adhesive, whereby the adhesive rheology is temporarily changed in situ so that the adhesive flows to a predetermined thickness to permit the chip to be pressed to a predetermined distance from said leadframe.
A process for die bonding a microelectronic chip to a leadframe with an adhesive characterized as a yield stress fluid, comprising the steps of temporarily changing in situ the rheology of said adhesive without gripping said chip by inducing a vibrational force in a direction which is substantially perpendicular to a surface of said chip which is in contact with said adhesive, and pressing said chip so that said adhesive flows to a predetermined thickness and said chip is positioned a predetermined distance from said leadframe.
Dependencies are inferred from the claim text.