Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material

A method for removing particles from a semiconductor wafer comprising the steps of:

• providing a semiconductor wafer having an active side and a layer formed on the active side, the layer having a surface and particles on the surface, the particles being sub-micron in size;
• providing a tape for removing the particles from the surface, the tape comprising a carrier film made of polyolifin material and an adhesive layer made of an acrylic-based adhesive adhered to the carrier film;
• pressing the tape against the semiconductor wafer such that the adhesive layer of the tape comes into contact with the particles on the surface;
• peeling the tape off the semiconductor wafer such that the particles remain affixed to the adhesive layer of the tape and are removed from the wafer;
• and
• rinsing the semiconductor wafer with an organic solvent solution to remove any adhesive material which may have remained on the semiconductor wafer after exposure to the adhesion layer of the tape.

A method for removing particles from a semiconductor wafer comprising the steps of:

• providing a semiconductor wafer;
• depositing a layer of material onto the semiconductor wafer;
• polishing a surface of the layer of material using a slurry to form a polished surface, the polishing leaving particles on the polished surface;
• rinsing the semiconductor wafer after polishing;
• drying the semiconductor wafer after rinsing;
• applying tape to the polished surface after drying, wherein the tape comprises a carrier film and an adhesion layer, and wherein the tape is applied such that the adhesion layer is put into contact with the polished surface using a positive force, the adhesion layer adhering to the particles located on the polished surface, the tape being a cleanroom-compatible tape, wherein:
• (1) the adhesion layer, has greater adhesive force with the carrier film than with the polished surface;
• and (2) the adhesion layer contains glue molecules wherein adhesive forces between glue molecules is greater than the adhesive force between the glue molecules and the particles;
• removing the tape from the polished surface to remove the particles from the polished surface, the particles being sub-micron in geometry;
• and
• rinsing the semiconductor wafer with an organic solvent solution to remove any adhesive material which may have remained on the semiconductor wafer after exposure to the adhesion layer of the tape.