Process and soldering paste for soldering on large-area plates of aluminum or aluminum alloys and use of that process
AssigneeCastolin S.A.
InventorKlaus Dudel
Life of this patent
Estimating the term…
Abstract
In a process for soldering on large-area plates of aluminum or aluminum alloys on to a workpiece comprising an iron-base alloy, use is made of a soldering paste comprising a flux with about 50% potassium fluoride and about 50% aluminum fluoride, a solder powder with about 80 to 90% aluminum and 20 to 10% silicon and a binder on a polymethacrylate base. In addition the respective proportions of the flux are between 40 and 60% by weight, the solder powder between 60 and 40% by weight and the binder between 0.2 and 2% by weight.
Claims8
A process for the production of large-area plates of aluminum or aluminum alloys for fixing same on a workpiece comprising an iron-base alloy, for example an aluminum plate which is a good conductor of heat on the bottom of a cooking pot of stainless high-quality steel using a powder containing aluminum and silicon, and a flux with potassium and aluminum fluoride, characterized in that the plate is provided with a soldering paste of flux with about 50% potassium fluoride and about 50% aluminum fluoride, a solder powder with about 80 to 90% aluminum and 20 to 10% silicon and a binder comprising a monopropylene glycol, 10 to 30% by weight of a solution of butyl methacrylate and glycol ethers, glycol esters, ketones, in each case individually or in the form of a mixture, wherein the proportion of the binder is between 0.2 and 2% by weight, whereafter the coated plate is dried and aged.
A process for the production of large-area plates of aluminum or aluminum alloys for fixing same on a workpiece comprising an iron-base alloy, for example an aluminum plate which is a good conductor of heat on the bottom of a cooking pot of stainless high-quality steel using a powder containing aluminum and silicon, and a flux with potassium and aluminum fluoride, characterized in that the plate is provided with a soldering paste comprising flux with about 50% potassium fluoride and about 50% aluminum fluoride, a solder powder with about 80 to 90% aluminum and 20 to 10% silicon and a binder comprising a monopropylene glycol, 10 to 30% by weight of a solution of butyl methacrylate and a mixture of aliphatic and naphthenic hydrocarbons (C.sub.7 to C.sub.9), wherein the proportion of the binder is between 0.2 and 2% by weight, whereafter the coated plate is dried and aged.
Dependencies are inferred from the claim text.