Surface mounting stress relief device and method

A method for mounting a surface mount package onto a printed circuit board, the method comprising the steps of:

• providing a printed circuit board having a feedthrough extending from a top surface for carrying a surface mount package through the board to a bottom surface having conductive portion for distributing electronic signals, the feedthrough having a metallic portion proximate the board bottom surface, the metallic feedthrough portion in electrical contact with the board conductive portion, the feedthrough further having a non-metallic portion extending proximate the board top surface;
• providing a pin having a post for inserting into the feedthrough, the post having a proximal end and opposing distal end, the post having a width dimension for lateral movement within the feedthrough non-metallic portion, the pin further having a head integrally attached to the post proximal end;
• inserting the pin into the feedthrough for positioning the post into the metallic feedthrough portion, through the non-metallic portion, and extending the post distal end out of the feedthrough for supporting a package in spaced relation with the printed circuit board top surface;
• positioning the head for soldering to the metallic feedthrough portion;
• soldering the head to the metallic feedthrough portion using a high temperature solder for forming a solder joint which remains solid during subsequent joint soldering steps using a low temperature solder;
• attaching a low temperature solder to a conductive pad of a surface mount package to be carried by the printed circuit board;
• placing the pad onto the post distal end;
• exposing the printed circuit board and package to a temperature sufficient for reflowing the low temperature solder;
• and
• forming a low temperature solder joint with the pad and post distal end for attaching the package to the printed circuit board in a spaced relation with the board top surface, and wherein movement caused by a coefficient of thermal expansion mismatch is absorbed by movement of the post within the feedthrough non-metallic portion, thus providing stress relief to the solder joints.

A method for mounting a surface mount package onto a printed circuit board, the method comprising the steps of:

• inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough;
• positioning a pin proximal end in contact with a printed circuit board conductive surface;
• positioning a pin distal end for supporting a surface mount package in spaced relation with a printed circuit board opposing package mounting surface;
• soldering the pin proximal end to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent joint soldering steps using a low temperature solder;
• and
• soldering the pin distal end to a surface mount package conductive pad using a low temperature solder for forming a solder joint between the pad and pin distal end for attaching the package to the printed circuit board in a spaced relation with the board mounting surface, and wherein movement caused by a coefficient of thermal expansion mismatch is absorbed by movement of the pin within the feedthrough, thus providing stress relief to the solder joints.

A method for mounting an electronic component onto a printed circuit board, the method comprising the steps of:

• inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough;
• positioning a pin proximal end in contact with a printed circuit board conductive surface;
• positioning a pin distal end for supporting a component in spaced relation with a printed circuit board opposing component mounting surface;
• attaching the pin proximal end to the board conductive surface;
• and
• attaching the pin distal end to a component conductive pad for attaching the component to the printed circuit board in a spaced relation with the board mounting surface.