Plasma treating apparatus and plasma treating method
AssigneeAnelva Corporation
InventorHiroshi Doi
Life of this patent
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Abstract
The present invention is directed to a plasma treating apparatus, for generating plasma in a dielectric container and for treating the surface of a substrate with the plasma generated, which includes a hot air heating system for heating the dielectric container by blowing hot air to a central location on the outside surface of the dielectric container. The present invention is further directed to a plasma treating method for generating plasma in a dielectric container and for treating the surface of a substrate with the plasma generated which includes hot air heating for heating the dielectric container by blowing hot air to the outside surface of the dielectric container to a temperature at which a thin film does not deposit on the inside surface of the dielectric container.
Claims13
A plasma treating apparatus for treating a surface of a substrate with plasma, comprising:
- means for generating plasma in a dielectric container having an outside surface using high frequency power;
- and
- a hot air heating system for heating the dielectric container by blowing hot air to the outside surface of the dielectric container;
- the hot air heating system includes means for directing the hot air to a central location of and substantially uniformly around the dielectric container so that the dielectric container is uniformly heated.
A plasma treating apparatus for treating a surface of a substrate with plasma, comprising:
- means for generating plasma in a dielectric container having an outside surface and an antenna located adjacent said outside surface;
- and
- a hot air heating system for heating the dielectric container by blowing hot air between the antenna and the outside surface of the dielectric container.
Dependencies are inferred from the claim text.