Loading patent…
AssigneeLucent Technologies Inc.
InventorsDonald William Dahringer, Philip Hubbauer, William Roger Lambert, Alan Michael Lyons, Lloyd Shepherd, John David Weld
Estimating the term…
An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.
A method for protecting an electric assembly including a printed circuit board (PCB) having electronic components and separable connectors thereon, comprising the steps of:
Dependencies are inferred from the claim text.