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US 5,689,227 AGranted
Circuit board material with barrier layer
AssigneeOhmega Electronics, Inc.
InventorsPhong Xuan Nguyen, Steven Russell Nissen
Life of this patent
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Abstract
A circuit board material is disclosed which includes a support layer, at least one electrical resistance layer having a preselected resistivity adhered to the support layer, a barrier layer adhered to the electrical resistance layer, and a conductive layer adhered to the barrier layer. The barrier layer is capable of protecting the resistance layer from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material is also disclosed.
Claims12
A circuit board material comprising
- (a) a support layer;
- (b) an electrical resistance layer adhered to said support layer;
- (c) a barrier layer adhered to said electrical resistance layer, wherein said barrier layer has a thickness of less than about 0.1 .mu.m, is different in composition from said resistance layer and is capable of protecting said resistance layer from attack by alkaline ammoniacal copper etchants;
- and
- (d) a conductive layer adhered to said barrier layer.
2 more elements
A circuit board material comprising
- (a) a support layer;
- (b) a Ni--P electrical resistance layer adhered to said support layer;
- (c) a Ni--Sn barrier layer having a thickness of less than about 0.1 .mu.m adhered to said electrical resistance layer;
- and
- (d) a copper conductive layer adhered to said barrier layer.
2 more elements
A circuit board material comprising
- (a) a support layer;
- (b) an electrical resistance layer adhered to said support layer, wherein said resistance layer is comprised of a material selected from the group consisting of Ni--P and Ni--Cr;
- (c) a barrier layer adhered to said electrical resistance layer, wherein said barrier layer has a thickness of less than about 0.1 .mu.m, is comprised of a material selected from the group consisting of Ni--Sn, Co--Sn, Cd--Sn, Cd--Ni, Ni--Cr, Ni--Au, Ni--Pd, Ni--Zn, Sn--Pb, Sn--Zn, Ni and Sn, is different in composition from said resistance layer and is capable of protecting said resistance layer from attack by alkaline ammoniacal copper etchants;
- and
- (d) a conductive layer adhered to said barrier layer.
2 more elements
Dependencies are inferred from the claim text.