Partly aromatic copolyamide molding materials having high crystallinity

A partly aromatic semicrystalline thermoplastic polyamide molding composition, consisting essentially of

• A) from 40 to 100% by weight of a copolyamide composed of
• a.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid;
• a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid;
• a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine;
• a.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms;
• and
• a.sub.5) from 0 to 4 mol % of polyamide forming monomer units the molar percentages of components a.sub.1) to a.sub.5) together giving 100%, and
• B) from 0 to 50% by weight of a fibrous or particulate filler,
• C) from 0 to 30% by weight of an elastomeric polymer and
• D) from 0 to 30% by weight of conventional additives and processing assistants,
• the percentages by weight of components A) to D) together giving 100%.