Anodized aluminum substrate having increased breakdown voltage
AssigneeOlin Corporation
InventorsDeepak Mahulikar, Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock, Michael A. Holmes, Jeffrey M. Schlater, German J. Ramirez, Dexin Liang
Life of this patent
Estimating the term…
Abstract
There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.
Claims7
A component for electronic applications comprising:
- an anodizable metal core;
- an anodic film containing pores having first and second opposing surfaces, said first surface bonded to said core;
- and
- a dielectric polymer filling said pores and constituting a continuous film that coats said anodic film except for said first surface, said continuous film having a thickness of from about 0.0025 mm to about 0.051 mm and being effective to reduce the average surface roughness of said component.
A component for electronic applications comprising:
- a metallic core;
- a continuous film polymer coating said metallic core, said continuous film having a thickness of from about 0.0025 mm to about 0.051 mm and being effective to reduce the average surface roughness of said component and a metallized circuitry formed on an outwardly disposed surface of the continuous film polymer.
Dependencies are inferred from the claim text.