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US 5,688,583 AGranted
Adhesive for printed circuit board
AssigneeIbiden Co., Ltd.
InventorsMotoo Asai, Chie Onishi
Life of this patent
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AssigneeIbiden Co., Ltd.
InventorsMotoo Asai, Chie Onishi
Estimating the term…
There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.
A prepreg adhesive obtained by forming an adhesive by dispersing a cured fine powder of amino resin which is soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix, said uncured heat-resistant resin matrix being curable into a heat-resistant resin matrix which is hardly soluble in the acid or the oxidizing agent, impregnating a fibrous substrate with the adhesive, and removing the cured fine powder with the acid or the oxidizing agent to form a roughened surface for the formation of a conductor pattern through electroless plating.
A method of forming a prepreg adhesive for the formation of a conductor pattern through electroless plating on a roughened surface comprising:
Dependencies are inferred from the claim text.