Method of making an electronic package structure utilizing aluminum nitride/aluminum composite material
AssigneeHughes Aircraft Company
InventorsM. Akbar Ali, Carl W. Peterson, Hutan Taghavi, Bruce W. Buller
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Abstract
A packaged electronic structure includes an electronic device, and a package to which the electronic device is affixed. At least a portion of the package is made of a composite material of aluminum nitride dispersed in aluminum. The composite material is preferably prepared by mixing powders of the aluminum nitride and aluminum, and thereafter pressing and sintering the mixture.
Claims14
A method for making an electronic package structure, comprising the steps of:
- preparing a mixture of aluminum nitride powder and aluminum powder, there being no binder present in the mixture, wherein the step of preparing includes the step of
- providing a mixture of about 80 percent by weight of aluminum nitride, balance aluminum;
- densifying the mixture to form a composite material;
- and
- forming an electronic package structure from the composite material.
A method for making an electronic package structure, comprising the steps of:
- preparing a mixture of aluminum nitride powder and aluminum powder, there being no binder present in the mixture, wherein the step of preparing includes the step of furnishing aluminum nitride powder as a mixture of coarse aluminum nitride powder having a particle size range of about -140+240 mesh and fine aluminum nitride powder having a particle size range of about -400 mesh;
- densifying the mixture to form a composite material;
- and
- forming an electronic package structure from the composite materials.
A method for making an electronic package structure, comprising the steps of:
- preparing a mixture of about 80 weight percent aluminum nitride powder and about 20 weight percent aluminum powder.
- densifying the mixture to form a comprise material, the step of densifying including a step of hot isostatically pressing the mixture;
- forming an electronic package structure from the composite material;
- and affixing an electronic device to the package structure, the electronic device having an aluminum oxide substrate.
Dependencies are inferred from the claim text.