Method and apparatus for laser cutting
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsShigehiro Yoshiyasu, Masaru Kanaoka
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsShigehiro Yoshiyasu, Masaru Kanaoka
Estimating the term…
A laser cutting method is provided for laser cutting a workpiece made of a metallic material to form hole having a desired shape, in which many of a second set of laser cutting conditions are different from a set of first laser cutting conditions, in order to avoid a chipping phenomenon when switching laser cutting conditions. The first laser cutting conditions are used for cutting the workpiece up to a predetermined distance short of the end point of the cut. The second set of cutting conditions are used for cutting the workpiece between an end point of the cut along the circumference of the hole, and a point a predetermined distance short of the end point of the cut. The focus position in the second laser cutting conditions is the same as the focus position in the first laser cutting conditions. Moreover, other of the second cutting conditions are the same as corresponding ones of the first set of cutting conditions.
A laser cutting method for laser cutting a metallic material workpiece to form a hole in said workpiece, said hole having a desired shape, comprising the steps of:
A laser cutting method for laser cutting a metallic material workpiece to form a hole in the workpiece, the hole having a desired shape, comprising the steps of:
A laser cutting apparatus, comprising:
A laser cutting apparatus, comprising:
A laser cutting method for laser cutting a metallic material workpiece to form a hole in said workpiece, said hole having a desired shape, comprising the steps of:
Dependencies are inferred from the claim text.