Method and apparatus for polishing a semiconductor substrate wafer
AssigneeNational Semiconductor Corporation
InventorRahul Jairath
Life of this patent
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Abstract
A semiconductor wafer polishing apparatus includes a housing and a turntable mounted in the housing. The turntable has an axis of rotation and a surface for affixing a semiconductor wafer. The polishing apparatus also includes a motor mounted to the housing and connected to the turntable to supply a torque for rotating the turntable about the axis of rotation. A polishing assembly is connected to the housing and extends adjacent to the turntable surface. A polishing pad is affixed to the polishing assembly and is positionable to contact the semiconductor wafer. Some polishing pads are cylindrical in form. Other polishing pads have a conical form.
Claims19
A semiconductor wafer polishing apparatus comprising:
- a housing;
- a turntable mounted in the housing, having an axis of rotation and having a surface for affixing a semiconductor wafer;
- a motor mounted to the housing and coupled to the turntable to supply a torque for rotating the turntable about the axis of rotation;
- a polishing assembly coupled to the housing and extending adjacent to the turntable surface;
- and
- a polishing pad affixed to the polishing assembly and being positionable to contact the semiconductor wafer.
A semiconductor wafer polishing apparatus comprising:
- a housing;
- a turntable mounted in the housing, having an axis of rotation and having a surface for affixing a semiconductor wafer;
- a motor mounted to the housing and coupled to the turntable to supply a torque for rotating the turntable about the axis of rotation;
- a polishing assembly coupled to the housing and extending adjacent to the turntable surface;
- a polishing pad coupled to the polishing assembly and being positionable to contact the semiconductor wafer;
- a member mounted in the polishing assembly, having an axis of rotation and having a surface for affixing the polishing pad;
- a polishing assembly motor mounted to the polishing assembly and coupled to the member to supply a torque for rotating the polishing pad about the member axis of rotation;
- and
- a pad reconditioner coupled to the polishing assembly and being positionable to contact the polishing pad.
A semiconductor wafer polishing apparatus comprising:
- a housing;
- a turntable mounted in the housing, having an axis of rotation and having a surface for affixing a semiconductor wafer;
- a motor mounted to the housing and coupled to the turntable to supply a torque for rotating the turntable about the axis of rotation;
- a polishing assembly coupled to the housing and extending adjacent to the turntable surface;
- a polishing pad coupled to the polishing assembly and being positionable to contact the semiconductor wafer;
- a cleaning assembly coupled to the housing and extending adjacent to the turntable surface;
- and
- a cleaning pad coupled to the cleaning assembly and being positionable to contact the semiconductor wafer.
A semiconductor wafer polishing apparatus comprising:
- a housing;
- a turntable mounted in the housing, having an axis of rotation and having a surface for affixing a semiconductor wafer;
- a motor mounted to the housing and coupled to the turntable to supply a torque for rotating the turntable about the axis of rotation;
- a polishing assembly coupled to the housing and extending adjacent to the turntable surface;
- a polishing pad coupled to the polishing assembly and being positionable to contact the semiconductor wafer:
- wherein:
- the turntable is flat and cylindrical in form;
- the semiconductor wafer has the form of a circular disk;
- and
- the diameter of the turntable is substantially the same as the diameter of the semiconductor wafer.
A semiconductor wafer polishing apparatus comprising:
- a housing;
- a turntable mounted in the housing, having an axis of rotation and having a surface for affixing a semiconductor wafer;
- a motor mounted to the housing and coupled to the turntable to supply a torque for rotating the turntable about the axis of rotation;
- a polishing assembly coupled to the housing and extending adjacent to the turntable surface;
- and
- a polishing pad coupled to the polishing assembly and being positionable to contact the semiconductor wafer;
- wherein the polishing pad has a cylindrical form.
A semiconductor wafer polishing apparatus comprising:
- a housing;
- a turntable mounted in the housing, having an axis of rotation and having a surface for affixing a semiconductor wafer;
- a motor mounted to the housing and coupled to the turntable to supply a torque for rotating the turntable about the axis of rotation;
- a polishing assembly coupled to the housing and extending adjacent to the turntable surface;
- and
- a polishing pad coupled to the polishing assembly and being positionable to contact the semiconductor wafer;
- wherein the polishing pad has a conical form.
A semiconductor wafer polishing apparatus comprising:
- a housing;
- rotating means coupled to the housing for rotating the semiconductor wafer at a controlled angular velocity and direction;
- a polishing pad;
- positioning means coupled to the housing and to the polishing pad for positioning the polishing pad at a selected location relative to the semiconductor wafer;
- and
- pressure means coupled to the housing and coupled to the positioning means for pressing the polishing pad into contact with the rotating semiconductor wafer at a controlled pressure.
Dependencies are inferred from the claim text.