Water-based urethane adhesive

A water-based adhesive composition, comprising an admixture of:

• a first aliphatic water-based urethane resin that is the reaction product of polycaprolactonediol or polycaprolactonetriol, 4,4-methylene bis(cyclohexyl isocyanate), and dimethylolpropionic acid extended with a diamine, said first aliphatic water-based urethane resin comprising from about 99 to about 20 percent by weight of said composition;
• a second aliphatic water-based urethane resin that is the reaction product of 2,6-hexanediol, 4,4-methylene bis(cyclohexyl isocyanate), and dimethylolpropionic acid extended with a diamine, said second aliphatic water-based urethane resin comprising from about 1 to about 80 percent by weight of said composition;
• and
• a tackifier comprising about 3.5 to about 7.5 percent by weight of said composition.

A water-based adhesive composition, comprising:

• about 68% by weight Q-THANE QW20-1;
• about 26% by weight Q-THANE QW18-1;
• about 5.5% by weight TACOLYN 1085;
• about 0.005% by weight butoxyethanol;
• about 0.005% by weight Dow Corning #62 defoamer;
• and
• about 0.005% by weight Silwet surfactant.

A method of adhering a workpiece to a substrate, comprising the steps of:

• a) applying an adhesive composition to a substrate, said adhesive composition comprising an admixture of:
• a first aliphatic water-based urethane resin that is the reaction product of polycaprolactonediol or polycaprolactonetriol, 4,4-methylene bis(cyclohexyl isocyanate), and dimethylolpropionic acid extended with a diamine, said first aliphatic water-based urethane resin comprising from about 99 to about 20 percent by weight of said composition;
• a second aliphatic water-based urethane resin that is the reaction product of 2,6-hexanediol, 4,4-methylene bis(cyclohexyl isocyanate), and dimethylolpropionic acid extended with a diamine, said second aliphatic water-based urethane resin comprising from about 1 to about 80 percent by weight of said composition;
• and
• a tackifier comprising about 0.1 to about 20 percent by weight of said composition;
• b) drying said adhesive composition at a temperature of from 400.degree. to 600.degree. F. for from between 30 min and 10 sec;
• and
• c) adhering said workpiece to said substrate.