Solder bearing lead
AssigneeNorth American Specialties Corporation
InventorsJack Seidler, Leonard J. Pollock
Life of this patent
Estimating the term…
Abstract
A solder-bearing metallic lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a substrate or other conductive pad.
Claims9
A connector arrangement for a substrate having a row of conductive pads, comprising:
- a carrier strip of electrically conductive material of substantially uniform thickness,
- a plurality of elongated conductive leads extending laterally from said carrier strip, each lead being integrally connected to said carrier strip at one end of the lead, said leads being parallel and spaced corresponding to said pads,
- each lead comprising:
- a generally flat body portion of substantially uniform width and thickness, with an upper surface and a lower surface,
- a longitudinally extending solder-bearing portion at a predetermined position along said lead adjoining said flat body portion,
- said solder-bearing portion being narrower than said adjoining body portion and a shoulder between said solder-bearing portion and said flat body portion at an end of said solder-bearing portion, and
- a solder mass partially surrounding said solder-bearing portion, while leaving uncovered a portion contiguous to said lower surface such that said solder mass and said solder bearing portion are in contact with said substrate conductive pad,
- whereby said solder mass is prevented from longitudinal movement by said shoulder and from transverse movement by said narrower portion, and said lead may be soldered to a corresponding pad by placing said uncovered portion in contact with said pad and reflowing said solder mass.
A solder-bearing lead for connection to a substrate conductive pad comprising
- an elongated lead body of electrically conductive material, said lead body being generally flat and having a section with substantially uniform width and thickness with an upper surface and a lower surface,
- said lead body having a longitudinally extending solder-bearing portion at a predetermined position along said lead body and adjoining a uniform thickness section of said lead body,
- said solder-bearing portion having a cross-section with undercuts thereon,
- said lead having a shoulder between said uniform thickness body section and said solder-bearing portion,
- a solder mass partially surrounding said solder-bearing portion and extending around said undercuts, but leaving a portion of said solder-bearing portion uncovered such that said solder mass and said solder bearing portion are in contact with said substrate conductive pad,
- whereby said solder mass is prevented from longitudinal movement by said shoulder and from transverse movement by said undercuts, and said lead may be soldered to a corresponding pad by placing said uncovered portion in contact with said pad and reflowing said solder mass.
Dependencies are inferred from the claim text.