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US 5,688,116 AGranted
Heat treatment process
AssigneesTokyo Electron Limited, Tokyo Electron Tohoku Kabushiki Kaisha
InventorsJunichi Kobayashi, Eiichiro Takanabe
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AssigneesTokyo Electron Limited, Tokyo Electron Tohoku Kabushiki Kaisha
InventorsJunichi Kobayashi, Eiichiro Takanabe
Estimating the term…
A number of semiconductor wafers are held in a ladder boat at, e.g., a 3/16 inch arrangement pitch of wafers W, and the ladder boat is loaded into a vertical heat treatment furnace. Then an interior of the heat treatment furnace is heated up to 900.degree. C. at a high temperature raising rate of, e.g., 30.degree. C./minute. Subsequently the interior is heated in steps at low temperature raising rates, e.g., at below 14.degree. C./minute up to a temperature region of, e.g., 980.degree. C. and at below 5.degree. C./minute up to a heating temperature of 1100.degree. C. These temperature raising rates are determined, based on results given by observation of presence and absence of slips in the wafers W heat-treated in various temperature raising patterns for different wafer arrangement pitches, so that the wafers can be heat-treated effectively without occurrence of slips. Widening said arrangement pitch to 3/8 inches allows higher temperature raising rates to be set.
A process for heat treating a plurality of objects supported by a holding means at a vertical interval in a heat treatment furnace, the process comprising:
A process for heat treating a plurality of objects using a holding means having a plurality of support rods with a number of grooves defined therein at a vertical interval, the objects being supported in the grooves in a shelf-like manner and loaded into a heat treatment furnace, an interior of the heat treatment furnace being raised to a heat treatment temperature to conduct the heat treating of the objects, the process comprising:
A process for heat treating a plurality of objects using a holding means having a plurality of support rods with a number of grooves defined therein at a vertical interval, the objects being supported in the grooves in a shelf-like manner and loaded into a heat treatment furnace, an interior of the heat treatment furnace being heated to a heat treatment temperature to conduct the heat treating of the objects, the process comprising:
A process for heat treating a plurality of objects using a holding means having a plurality of support rods with a number of grooves defined therein at a vertical interval, the objects being supported in the grooves in a shelf-like manner and loaded into a heat treatment furnace, an interior of the heat treatment furnace being heated to a heat treatment temperature to conduct the heat treating of the objects, the process comprising:
A process for heat treating semiconductor wafers mounted in a mounting jig in a heat treating furnace, comprising:
Dependencies are inferred from the claim text.